The Ni mesh was incorporated into the Cu/Sn58Bi/Cu bonding as a reinforcing skeleton to achieve an enhancement effect analogous to steel reinforcement in concrete. Ultrasonic-assisted soldering (UAS) improved the metallurgical bond among the solder, Ni mesh, and substrate. It facilitated the formation of (Cu, Ni)6Sn5 intermetallic compounds (IMCs) layers, increasing the joint strength. Observations indicated that ultrasonic treatment effectively refined the (Cu, Ni)6Sn5 grains and induced a uniform preferred orientation of β-Sn and Bi grains in the joint matrix adjacent to the Ni mesh. The shear strength of the joint reached 72.23 MPa when the ultrasonic application was sustained for 15 s, achieving the fabrication of a high-strength point with low energy consumption. First-principles calculations have confirmed that changes in the Ni content within (Cu, Ni)6Sn5 IMCs improved the stability of the crystal structure. Furthermore, the variations in content could potentially improve the mechanical and electrical properties of the (Cu, Ni)6Sn5. Enhancements in ultrasonic efficiency and the reinforcement of IMC structures offer new avenues for research in green and high-performance electronic packaging material joining technologies.

中文翻译：

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Ni网格增强超声辅助Cu/Sn58Bi/Cu接头性能：实验与第一性原理计算


Ni 网格作为增强骨架加入 Cu/Sn58Bi/Cu 粘合中，以达到类似于混凝土中钢筋的增强效果。超声波辅助焊接 （UAS） 改善了焊料、Ni 网格和基板之间的冶金结合。它促进了 （Cu， Ni）6Sn5 金属间化合物 （IMC） 层的形成，提高了接头强度。观察结果表明，超声处理有效地细化了 （Cu， Ni）6Sn5 晶粒，并在与 Ni 网格相邻的接头基体中诱导了 β-Sn 和 Bi 晶粒的均匀择优取向。超声应用持续 15 s 时，接头的剪切强度达到 72.23 MPa，实现了低能耗的高强度点的制造。第一性原理计算证实，（Cu、Ni）6Sn5 IMCs 中 Ni 含量的变化提高了晶体结构的稳定性。此外，含量的变化可能会改善 （Cu， Ni）6Sn5 的机械和电气性能。超声效率的提高和 IMC 结构的增强为绿色和高性能电子封装材料连接技术的研究提供了新的途径。