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Interfacial adhesion in flexible electronics: Materials, structures and applications
Coordination Chemistry Reviews ( IF 20.3 ) Pub Date : 2024-10-24 , DOI: 10.1016/j.ccr.2024.216278 Mingyang Lu, Jia You, Mengjie Gao, Wendong Li, Cancan Zhang, Bolin Zhu, Chong Peng, Shiteng Wu, Dazhenlamu, Wei Ren, Guangxian Li, Chuan Fei Guo, Junlong Yang
Coordination Chemistry Reviews ( IF 20.3 ) Pub Date : 2024-10-24 , DOI: 10.1016/j.ccr.2024.216278 Mingyang Lu, Jia You, Mengjie Gao, Wendong Li, Cancan Zhang, Bolin Zhu, Chong Peng, Shiteng Wu, Dazhenlamu, Wei Ren, Guangxian Li, Chuan Fei Guo, Junlong Yang
Flexible electronics, featuring low thinness, high conformability, multifunctionality, and high portability, have revolutionized the interaction experiences of human beings. This emerging technology is also ushering in groundbreaking advancements in intelligent manufacturing, humanoid robots, and digital medicine. However, the diverse functionalities and applications of flexible electronics often require integration of multilayer interfaces in devices. The assembly of such multilayer and multimaterial structures frequently faces challenges of interfacial incompatibilities of interfaces, including the mismatch in mechanical properties, chemistry, and functionalities. These challenges can compromise the long-term reliability and efficiency of either the interfaces in a device or the interface between a device and human tissues/robots. A seamlessly integrated flexible electronic device not only mitigates the risk of interfacial delamination but also enhances the mechanical stability of the device in dynamic or multifaceted environments. This manuscript offers an exhaustive review on tough interfaces in flexible electronics enabled by physical interactions, covalent chemical bonds or structural designs. Moreover, considering their primary applications — skin-wearables, implantable, and robotics — we delve into the latest breakthroughs, persistent challenges, and pragmatic strategies associated with reinforced adhesive interfaces. Such a discussion furnishes invaluable perspectives for the conceptualization and fabrication of highly durable flexible devices.
中文翻译:
柔性电子器件中的界面粘附力:材料、结构和应用
柔性电子产品具有低薄、高顺应性、多功能、高便携性等特点,彻底改变了人类的交互体验。这项新兴技术还在智能制造、类人机器人和数字医学方面取得了突破性进展。然而,柔性电子产品的各种功能和应用通常需要在设备中集成多层接口。这种多层和多材料结构的组装经常面临界面界面不兼容的挑战,包括机械性能、化学和功能的不匹配。这些挑战可能会损害设备中接口或设备与人体组织/机器人之间接口的长期可靠性和效率。无缝集成的柔性电子器件不仅可以降低界面分层的风险,还可以增强器件在动态或多面环境中的机械稳定性。本手稿对由物理相互作用、共价化学键或结构设计实现的柔性电子器件中的坚韧界面进行了详尽的回顾。此外,考虑到它们的主要应用——皮肤可穿戴设备、植入物和机器人技术——我们深入研究了与增强胶粘剂界面相关的最新突破、持续挑战和实用策略。这样的讨论为高度耐用的柔性器件的概念化和制造提供了宝贵的视角。
更新日期:2024-10-24
中文翻译:
柔性电子器件中的界面粘附力:材料、结构和应用
柔性电子产品具有低薄、高顺应性、多功能、高便携性等特点,彻底改变了人类的交互体验。这项新兴技术还在智能制造、类人机器人和数字医学方面取得了突破性进展。然而,柔性电子产品的各种功能和应用通常需要在设备中集成多层接口。这种多层和多材料结构的组装经常面临界面界面不兼容的挑战,包括机械性能、化学和功能的不匹配。这些挑战可能会损害设备中接口或设备与人体组织/机器人之间接口的长期可靠性和效率。无缝集成的柔性电子器件不仅可以降低界面分层的风险,还可以增强器件在动态或多面环境中的机械稳定性。本手稿对由物理相互作用、共价化学键或结构设计实现的柔性电子器件中的坚韧界面进行了详尽的回顾。此外,考虑到它们的主要应用——皮肤可穿戴设备、植入物和机器人技术——我们深入研究了与增强胶粘剂界面相关的最新突破、持续挑战和实用策略。这样的讨论为高度耐用的柔性器件的概念化和制造提供了宝贵的视角。