The monolithic 3D integration of 2D molybdenum disulfide memtransistors and graphene chemitransistors can be used to create near-sensor computing chips with high interconnect density and a vertical separation between tiers of less than 50 nm.

中文翻译：

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与 2D 材质的整体 3D 集成


2D 二硫化钼内存晶体管和石墨烯化学晶体管的单片 3D 集成可用于创建具有高互连密度和小于 50 nm 的层之间垂直分离的近传感器计算芯片。