Integrating flexible electronics and photonics can create revolutionary technologies, but combining these components on a single polymer device has been difficult, particularly for high-volume manufacturing. Here, we present a robust chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where ultrathin polymer electronic and optoelectronic chiplets are vertically bonded at room temperature and shaped into application-specific forms with monolithic Input/Output (I/O). This process was used to develop a flexible 3D integrated optrode with high-density microelectrodes for electrical recording, micro light-emitting diodes (μLEDs) for optogenetic stimulation, temperature sensors for bio-safe operations, and shielding designs to prevent optoelectronic artifacts. CHIP enables simple, high-yield, and scalable 3D integration, double-sided area utilization, and miniaturization of connection I/O. Systematic characterization demonstrated the scheme’s success and also identified frequency-dependent origins of optoelectronic artifacts. We envision CHIP being applied to numerous polymer-based devices for a wide range of applications.

集成柔性电子学和光子学可以创造革命性的技术，但将这些组件组合在单个聚合物器件上一直很困难，特别是对于大批量制造而言。在这里，我们提出了一种强大的基于聚合物的电路（CHIP）的小芯片级异构集成，其中超薄聚合物电子和光电小芯片在室温下垂直粘合，并通过单片输入/输出（I/O）成型为特定于应用的形式。该工艺用于开发柔性 3D 集成光极，该光极具有用于电记录的高密度微电极、用于光遗传学刺激的微型发光二极管 (μLED)、用于生物安全操作的温度传感器以及防止光电伪影的屏蔽设计。 CHIP 可实现简单、高产量且可扩展的 3D 集成、双面面积利用率以及连接 I/O 的小型化。系统表征证明了该方案的成功，并确定了光电伪影的频率相关起源。我们设想 CHIP 能够应用于众多基于聚合物的设备，以实现广泛的应用。