Electronic systems and devices operating at significant power levels demand sophisticated solutions for heat dissipation. Although materials with high thermal conductivity hold promise for exceptional thermal transport across nano- and microscale interfaces under ideal conditions, their performance often falls short by several orders of magnitude in the complex thermal interfaces typical of real-world applications. This study introduces mechanochemistry-mediated colloidal liquid metals composed of Galinstan and aluminium nitride to bridge the practice–theory disparity. These colloids demonstrate thermal resistances of between 0.42 and 0.86 mm² K W⁻¹ within actual thermal interfaces, outperforming leading thermal conductors by over an order of magnitude. This superior performance is attributed to the gradient heterointerface with efficient thermal transport across liquid–solid interfaces and the notable colloidal thixotropy. In practical devices, experimental results demonstrate their capacity to extract 2,760 W of heat from a 16 cm² thermal source when coupled with microchannel cooling, and can facilitate a 65% reduction in pump electricity consumption. This advancement in thermal interface technology offers a promising solution for efficient and sustainable cooling of devices operating at kilowatt levels.

以高功率水平运行的电子系统和设备需要复杂的散热解决方案。尽管具有高导热率的材料有望在理想条件下跨纳米级和微米级界面实现出色的热传输，但在实际应用中典型的复杂热界面中，它们的性能往往比实际应用低几个数量级。本研究介绍了机械化学介导的由 Galinstan 和氮化铝组成的胶体液体金属，以弥合实践与理论的差异。这些胶体在实际热界面内的热阻在 0.42 到 0.86 mm² K W⁻¹ 之间，比领先的热导体高出一个数量级以上。这种卓越的性能归功于梯度异质界面，具有跨液固界面的高效热传输和显着的胶体触变性。在实际设备中，实验结果表明，当与微通道冷却相结合时，它们能够从 16 cm² 热源中提取 2,760 W 的热量，并有助于将泵的耗电量减少 65%。热界面技术的这一进步为高效、可持续地冷却千瓦级设备提供了一种有前途的解决方案。