Thermal conductivity is critical to the stable operation, service life and reliability of electronic equipment. Solving thermal management problems in electronic devices requires the development of composites with high thermal conductivity. The interface between the filler and the matrix is formed due to the addition of the thermal conductive filler. The presence of interfaces greatly affects the heat transfer of composites. Therefore, it is a challenge to effectively control interface behavior and reduce interface thermal resistance. This review describes the mechanism of heat conduction and the theory of thermal conductivity of composites, and analyzes in depth the effect of interfacial thermal resistance on phonon heat transfer. The importance of improving the thermal conductivity of composites based on interfacial regulation strategies is illustrated from three aspects: non-directional structure design of fillers, co-doping of fillers and multi-layer structure design. Combined with the current research status, this review also describes the multifunctionality of thermally conductive composites. It is hoped that this review will provide some guidance for the study of polymer-based thermally conductive composites.

中文翻译：

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具有高导热性的聚合物复合材料：理论、仿真、结构和界面调控


导热系数对于电子设备的稳定运行、使用寿命和可靠性至关重要。解决电子设备中的热管理问题需要开发具有高导热性的复合材料。填料和基体之间的界面是由于添加了导热填料而形成的。界面的存在极大地影响了复合材料的传热。因此，有效控制界面行为和降低界面热阻是一项挑战。本文综述了复合材料的热传导机理和热导理论，并深入分析了界面热阻对声子传热的影响。从填料的无定向结构设计、填料的共掺杂和多层结构设计三个方面阐述了基于界面调控策略提高复合材料热导率的重要性。结合目前的研究现状，本文还描述了导热复合材料的多功能性。希望本文能为聚合物基导热复合材料的研究提供一些指导。