As a kind of triply periodic minimal surface (TPMS), the Gyroid-TPMS is utilized for fluid cooling system with good hydraulic and thermal performances. In this study, a special fin structure based on Gyroid-TPMS, referred to as the Gyroid-fin, is designed to replace the plate-fin of the conventional heat sink (HS) for cooling the integrated power chips. The multi-physical simulations are modelled for numerical analysis, and the specific test system is designed to compare the thermal performances of Gyroid-fin HS and plate-fin HS. The numerical simulation indicates that the Gyroid-fin can induce eccentric helical flows and enhance the convective heat transfer significantly. The temperature distributions range from 35.69 to 46 °C on the surface of the plate-fin to 38.5−43.2 °C on that of Gyroid-fin. The temperature difference is reduced from 10.31 °C of plate-fin HS down to less than 4.7 °C of Gyroid-fin HS. Besides, the Gyroid-fin provides an area of 850.3 cm for heat dissipation which is almost 3 times of the plate-fin, and the thermal resistance of Gyroid-fin HS is about 15 % less than that of plate-fin HS. The Gyroid-fin HS has a better temperature uniformity in all directions than plate-fin HS. With the flow rate increasing, both the maximum surface temperature and the surface temperature difference of Gyroid-fin HS and plate-fin HS will decrease, and the pressure drops of Gyroid-fin HS and plate-fin HS will increase. For the balance of pressure drop and thermal resistance, the operating point can be set at the flow rate of 6 L/min for both Gyroid-fin HS and plate-fin HS. Moreover, for the same value of thermal resistance, the Gyroid-fin HS requires a lower flow rate than plate-fin HS, and it also means less pump power cost for the liquid cooling system. This work helps to solve the constraint of heat sinks that heat dissipation capacity of electronic devices in high power density applications.

中文翻译：

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功率芯片用Gyroid-fin散热器的热性能


Gyroid-TPMS作为一种三周期最小表面（TPMS），用于流体冷却系统，具有良好的水力和热性能。在本研究中，设计了一种基于Gyroid-TPMS的特殊翅片结构（称为Gyroid-fin）来代替传统散热器（HS）的板翅，用于冷却集成功率芯片。对多物理模拟进行建模进行数值分析，并设计了具体的测试系统来比较Gyroid-fin HS和Plate-fin HS的热性能。数值模拟表明，螺旋翅片可以引起偏心螺旋流，显着增强对流换热。板翅片表面的温度分布范围为 35.69~46 °C，Gyroid-fin 表面的温度分布范围为 38.5−43.2 °C。温差从板翅式 HS 的 10.31 °C 降至 Gyroid-fin HS 的 4.7 °C 以下。此外，Gyroid-fin提供了850.3 cm2的散热面积，几乎是板鳍式散热面积的3倍，并且Gyroid-fin HS的热阻比板鳍式HS减少了约15%。与板翅式 HS 相比，螺旋翅式 HS 在各个方向上的温度均匀性更好。随着流量的增大，Gyroid-fin HS和板翅式HS的最高表面温度和表面温差均减小，Gyroid-fin HS和板翅式HS的压降增大。为了平衡压降和热阻，Gyroid-fin HS 和板翅 HS 的工作点均可设置为 6 L/min 的流量。此外，对于相同的热阻值，Gyroid-fin HS比板翅式HS需要更低的流量，这也意味着液体冷却系统的泵功率成本更低。 这项工作有助于解决高功率密度应用中散热器对电子器件散热能力的限制。