Traditional electromagnetic interference–shielding materials are predominantly electrically conductive, posing short-circuit risks when applied in highly integrated electronics. To overcome this dilemma, we propose a microcapacitor-structure model comprising conductive fillers as polar plates and intermediate polymer as a dielectric layer to develop insulating electromagnetic interference–shielding polymer composites. The electron oscillation in plates and dipole polarization in dielectric layers contribute to the reflection and absorption of electromagnetic waves. Guided by this, the synergistic nonpercolation densification and dielectric enhancement enable our composite to combine high resistivity, shielding performance, and thermal conductivity. Its insulating feature allows for direct potting into the crevices among assembled components to address electromagnetic compatibility and heat-accumulation issues.

中文翻译：

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绝缘电磁屏蔽硅胶化合物可实现直接灌封电子元件


传统的电磁干扰屏蔽材料主要是导电的，当应用于高度集成的电子产品时，会带来短路风险。为了克服这一困境，我们提出了一种微电容器结构模型，该模型由导电填料作为极性板和中间聚合物作为介电层组成，以开发绝缘电磁干扰屏蔽聚合物复合材料。板中的电子振荡和介电层中的偶极极化有助于电磁波的反射和吸收。在此指导下，协同非渗透致密化和介电增强使我们的复合材料能够将高电阻率、屏蔽性能和导热性相结合。其绝缘功能允许直接灌封到组装组件之间的缝隙中，以解决电磁兼容性和热量积累问题。