Multilayer Reconfigurable 3D Photonics Integrated Circuits Based on Deposition Method,Laser & Photonics Reviews

当前位置： X-MOL 学术 › Laser Photonics Rev. › 论文详情

Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)

Multilayer Reconfigurable 3D Photonics Integrated Circuits Based on Deposition Method
Laser & Photonics Reviews ( IF 9.8 ) Pub Date : 2024-09-10 , DOI: 10.1002/lpor.202400827
Xinru Xu ₁ , Daming Zhang ₁ , Peng Zhang ₂ , Bo Tang ₂ , Yuexin Yin ₁

Affiliation

Photonics integrated circuits (PICs) can overcome the bottlenecks in communication capacity. 3D PIC technology is an attractive method for increasing density effectively and combining different materials on one chip for functional integration. In this study, a low‐cost and reconfigurable 3D integrated silicon photonics (SiPhs) platform is proposed fabricated by depositing polycrystalline silicon (poly‐Si) on crystalline silicon (c‐Si), which is patterned through deep ultraviolet (DUV) stepper‐based manufacturing process. The high mobility of poly‐Si ensures high‐speed and power‐efficient modulation. Based on the proposed 3D SiPhs platform, an 8 × 8 optical switch whose units are separated in different layers is fabricated and packaged. The switch shows average insertion losses of −13.98 and −15.86 dB, while working in “all‐cross” and “all‐bar” states, respectively. The crosstalk is lower than −19 and −11 dB for “all‐cross” and “all‐bar” states. Additionally, an overlayer switch located on the 1st and 3rd layers is proposed and experimentally demonstrated, which offers overlapping capabilities that are more compact compared with switches in a single‐layer platform. This validates the possibility of the large‐density integration scalability of the platform.

中文翻译：

基于沉积法的多层可重构3D光子集成电路

光子集成电路（PIC）可以克服通信容量的瓶颈。 3D PIC 技术是一种颇具吸引力的方法，可有效提高密度并将不同材料组合在一个芯片上以实现功能集成。在这项研究中，提出了一种低成本且可重构的 3D 集成硅光子 (SiPhs) 平台，该平台通过在晶体硅 (c-Si) 上沉积多晶硅 (poly-Si) 来制造，并通过深紫外 (DUV) 步进机进行图案化。基于制造工艺。多晶硅的高迁移率确保了高速和节能的调制。基于所提出的3D SiPhs平台，制造并封装了单元分离在不同层中的8×8光开关。该开关在“全交叉”和“全横”状态下工作时，平均插入损耗分别为 -13.98 和 -15.86 dB。对于“全交叉”和“全条”状态，串扰低于 -19 和 -11 dB。此外，还提出了位于第一层和第三层的重叠交换机并进行了实验证明，它提供了与单层平台中的交换机相比更紧凑的重叠功能。这验证了该平台大密度集成扩展的可能性。

更新日期：2024-09-10

点击分享查看原文

点击收藏

阅读更多本刊新发论文本刊介绍/投稿指南