With the continuous development of electronic devices and the information industry towards miniaturization, integration, and high-power consumption, the using of electronic devices will inevitably generate and accumulate heat, which will cause local high temperatures and will seriously reduce their performance, reliability, and lifetime. Therefore, having efficient heat-conducting functional materials is crucial to the normal and stable operation of electrical equipment and microelectronic products. In view of the excellent comprehensive performance of polymer-based thermally conductive materials (including intrinsic polymers and filler-filled polymer-based composites), it has shown great advantages in thermal management applications. In this review, the research status of preparing polymer-based thermally conductive composites and effective strategies to improve their thermal conductivity (TC) are reviewed. Compared with the higher cost and technical support with adjusting the molecular chain structure and cross-linking mode to improve the intrinsic TC of the polymer, introducing suitable fillers into the polymer to build a thermally conductive network or oriented structure can simply and efficiently improve the overall TC. Typical applications of polymer-based composites were discussed with detailed examples in the field of electronic packaging. Challenges and possible solutions to solve the issues are discussed together with the perspectives. This study provides guidance for the future development of polymer-based thermally conductive composites.

中文翻译：

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聚合物系导热功能材料概述


随着电子装置和信息产业向小型化、集成化、高耗电化方向的不断发展，电子设备的使用不可避免地会产生和积累热量，从而造成局部高温，并会严重降低其性能、可靠性和寿命。因此，拥有高效的导热功能材料对于电气设备和微电子产品的正常稳定运行至关重要。鉴于聚合物基导热材料（包括本征聚合物和填料填充聚合物基复合材料）的优异综合性能，它在热管理应用中显示出巨大的优势。本文综述了聚合物基导热复合材料制备的研究现状以及提高其导热系数 （TC） 的有效策略。相较于调整分子链结构和交联模式以改善聚合物本征TC的成本和技术支持较高，在聚合物中引入合适的填料以构建导热网络或定向结构，可以简单有效地改善整体TC。通过电子封装领域的详细示例讨论了聚合物基复合材料的典型应用。讨论了挑战和解决问题的可能解决方案以及观点。本研究为聚合物基导热复合材料的未来发展提供了指导。