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Structural and electrical properties of grafted Si/GaAsSb heterojunction
Applied Physics Letters ( IF 3.5 ) Pub Date : 2024-09-06 , DOI: 10.1063/5.0225069
Haris Naeem Abbasi 1 , Seunghyun Lee 2, 3 , Hyemin Jung 2 , Nathan Gajowski 2 , Yi Lu 1 , Yifan Wang 1 , Donghyeok Kim 1 , Jie Zhou 1 , Jiarui Gong 1 , Chris Chae 2 , Jinwoo Hwang 2 , Manisha Muduli 2 , Subramanya Nookala 1 , Zhenqiang Ma 1 , Sanjay Krishna 2
Affiliation  

The short-wave infrared (SWIR) wavelength, especially 1.55 μm, has attracted significant attention in various areas such as high-speed optical communication and LiDAR systems. Avalanche photodiodes (APDs) are a critical component as a receiver in these systems due to their internal gain, which enhances the system performance. Silicon-based APDs are promising since they are CMOS compatible, but they are limited in detecting 1.55 μm light detection. This study proposes a p-type Si on n-type GaAs0.51Sb0.49 (GaAsSb) lattice matched to InP substrates heterojunction formed using a grafting technique for future GaAsSb/Si APD technology. A p+Si nanomembrane is transferred onto the GaAsSb/AlInAs/InP substrate, with an ultrathin ALD-Al2O3 oxide at the interface, which behaves as both double-side passivation and quantum tunneling layers. The devices exhibit excellent surface morphology and interface quality, confirmed by atomic force microscope and transmission electron microscope. Also, the current–voltage (I–V) of the p+Si/n−GaAsSb heterojunction shows the rectifying characteristics with an ideality factor of 1.8. The I–V tests across multiple devices confirm high consistency and yield. Furthermore, the x-ray photoelectron spectroscopy measurement reveals that GaAsSb and Si are found to have type-II band alignment with a conduction band offset of 50 meV, which is favorable for the high-bandwidth APD application. The demonstration of the GaAsSb/Si heterojunction highlights the potential to advance current SWIR PD technologies.

中文翻译:


接枝 Si/GaAsSb 异质结的结构和电学特性



短波红外 (SWIR) 波长,尤其是 1.55 μm,在高速光通信和 LiDAR 系统等各个领域引起了极大的关注。雪崩光电二极管 (APD) 是这些系统中作为接收器的关键组件,因为它们具有内部增益,可增强系统性能。硅基 APD 很有前途,因为它们与 CMOS 兼容,但它们在检测 1.55 μm 光检测方面受到限制。本研究提出了一种 n 型 GaAs0.51Sb0.49 (GaAsSb) 晶格上的 p 型硅,该晶格与使用接枝技术形成的 InP 衬底异质结相匹配,用于未来的 GaAsSb/Si APD 技术。p+Si 纳米膜被转移到 GaAsSb/AlInAs/InP 衬底上,界面处有超薄的 ALD-Al2O3 氧化物,其作用类似于双面钝化和量子隧穿层。这些器件表现出优异的表面形貌和界面质量,经原子力显微镜和透射电子显微镜证实。此外,p+Si/n-GaAsSb 异质结的电流-电压 (I-V) 显示出理想因子为 1.8 的整流特性。跨多个器件的 I-V 测试证实了高一致性和产量。此外,X 射线光电子能谱测量表明,GaAsSb 和 Si 具有 II 型能带对准,导带偏移为 50 meV,这有利于高带宽 APD 应用。GaAsSb/Si 异质结的演示凸显了推动当前 SWIR PD 技术的潜力。
更新日期:2024-09-06
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