Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures,ACS Photonics

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Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures
ACS Photonics ( IF 6.5 ) Pub Date : 2024-08-30 , DOI: 10.1021/acsphotonics.4c00784
Xiangyu Zhao ₁ , Hao Jiang _{1,

2} , Jiamin Liu ₁ , Changqing Liu ₁ , Hui Deng ₃ , Renjie Zhou ₄ , Nicholas X. Fang ₅ , Shiyuan Liu _{1,

2} , Jinlong Zhu _{1,

2,

6}

Affiliation

Due to its high bandwidth, low latency, low power consumption, and compact size, three-dimensional (3D) integration of semiconductor chips holds the promise of boosting the performance of integrated circuit systems. However, the applications of 3D stacked structures are constrained by the surface deformation of each thin layer induced by thermal effects, vibration, gravity, and other environmental stresses. Therefore, ensuring the performance and reliability of 3D stacked structures necessitates the precise measurement of nanoscale deformation in each layer. Furthermore, the spacing between layers in 3D stacked structures using modern microelectronics and packaging technologies is exceedingly small, making it impossible to measure the deformation of all layers. Here, we present a novel optical endoscope that fuses a miniaturized interferometry array, a laser-fabricated microprobe, and a highly efficient profile reconstruction algorithm for the precise measurements of surface deformation across all layers in 3D stacked structures. Our method offers a potentially effective and noninvasive way to address the challenges associated with in-line deformation measurement across all layers in real 3D stacked wafers and chips.

中文翻译：

直接监测三维堆叠结构中所有层的纳米级变形

由于其高带宽、低延迟、低功耗和紧凑的尺寸，半导体芯片的三维（3D）集成有望提高集成电路系统的性能。然而，3D堆叠结构的应用受到热效应、振动、重力和其他环境应力引起的每个薄层的表面变形的限制。因此，为了确保 3D 堆叠结构的性能和可靠性，需要精确测量每层的纳米级变形。此外，采用现代微电子和封装技术的3D堆叠结构中的层间距非常小，因此不可能测量所有层的变形。在这里，我们提出了一种新型光学内窥镜，它融合了微型干涉测量阵列、激光制造的微探针和高效的轮廓重建算法，用于精确测量 3D 堆叠结构中所有层的表面变形。我们的方法提供了一种潜在有效且非侵入性的方法来解决与真实 3D 堆叠晶圆和芯片中所有层的在线变形测量相关的挑战。

更新日期：2024-08-30

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