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Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
IEEE Transactions on Power Electronics ( IF 6.6 ) Pub Date : 2024-08-22 , DOI: 10.1109/tpel.2024.3447909 Shenyi Liu 1 , Vesa Vuorinen 1 , Xing Liu 2 , Olli Fredrikson 3 , Sebastian Brand 4 , Nikhilendu Tiwary 2 , Josef Lutz 2 , Mervi Paulasto-Kröckel 1
中文翻译：
功率循环测试下 IGBT 模块芯片贴装层的疲劳裂纹网络
更新日期：2024-08-22
IEEE Transactions on Power Electronics ( IF 6.6 ) Pub Date : 2024-08-22 , DOI: 10.1109/tpel.2024.3447909 Shenyi Liu 1 , Vesa Vuorinen 1 , Xing Liu 2 , Olli Fredrikson 3 , Sebastian Brand 4 , Nikhilendu Tiwary 2 , Josef Lutz 2 , Mervi Paulasto-Kröckel 1
Affiliation
中文翻译：
功率循环测试下 IGBT 模块芯片贴装层的疲劳裂纹网络
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