X-ray detection is critical for applications in medical diagnosis, industrial inspection, security checks, scientific inquiry and space exploration. Recent advances in materials science, electronics, manufacturing and artificial intelligence have greatly propelled the field forward. In this Review we examine fundamental principles and recent breakthroughs in X-ray detection and imaging technologies, with a focus on the interplay between electrical engineering techniques and X-ray-responsive materials. We highlight two primary approaches: semiconductor-based direct detection and scintillator-based indirect detection. We then discuss innovations such as photon-counting detectors and heterojunction phototransistors and emphasize the critical contributions of electrical engineering in the development of these cutting-edge detectors. Subsequently, we provide an overview of X-ray detection applications, ranging from biomedical imaging and resonant X-ray techniques for material analysis to nanometre-resolution circuit imaging. Finally, the Review summarizes future research directions, which encompass 3D and 4D X-ray imaging sensors, multispectral X-ray imaging and artificial intelligence-assisted medical image diagnosis.

X射线检测对于医疗诊断、工业检查、安全检查、科学探究和太空探索等应用至关重要。材料科学、电子、制造和人工智能的最新进展极大地推动了该领域的发展。在这篇综述中，我们研究了 X 射线检测和成像技术的基本原理和最新突破，重点关注电气工程技术和 X 射线响应材料之间的相互作用。我们重点介绍两种主要方法：基于半导体的直接检测和基于闪烁体的间接检测。然后，我们讨论光子计数探测器和异质结光电晶体管等创新，并强调电气工程在这些尖端探测器开发中的关键贡献。随后，我们概述了 X 射线检测应用，范围从生物医学成像和用于材料分析的共振 X 射线技术到纳米分辨率电路成像。最后，综述总结了未来的研究方向，包括3D和4D X射线成像传感器、多光谱X射线成像和人工智能辅助医学图像诊断。