The trend toward thinner and lighter electronic devices necessitates developing advanced thermal management solutions to address modern microprocessors’ escalating heat dissipation demands. This study introduces an advanced thermal solution incorporating a gyroid TPMS structure with remarkable physical properties for microprocessor cooling. Detailed investigations were conducted using a full-scale heat sink model to understand the inner geometric structure, flow, and heat transfer characteristics within a gyroid heat sink (GHS). The thermo-hydraulic performance of the GHS design was systematically assessed against that of a pinfin heat sink (PHS) across different porosities and flow rates. Both heat sinks were evaluated under non-uniform heating conditions, considering three heating schemes, each with eleven randomly distributed hotspots. The thermohydraulic performance was assessed by calculating temperature non-uniformity, thermal resistance, and pumping power. A correlation was established using the cell size and cell wall thickness of a unit cell of gyroid TPMS to calculate its hydraulic diameter. The analysis revealed that the enhanced thermal performance of the GHS design can be attributed to its intricate and convoluted flow structure, along with a significantly large heat transfer surface area. However, these same factors contribute to a notably high-pressure drop. Compared to the PHS design, the GHS design showed better thermal performance at all the selected porosities and flow rates, albeit with higher pumping powers. The GHS design showed improvement in the thermal performance as the porosity decreased. Investigation under heterogeneous heating conditions showed substantially lower temperatures at the hotspots in the GHS design, along with reduced temperature variation among them. The study’s findings provide valuable insight into the advantages and drawbacks of gyroid TPMS structure for their application in electronic cooling.

中文翻译：

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用于电子冷却的陀螺仪 TPMS 散热器


电子设备朝更薄、更轻的趋势需要开发先进的热管理解决方案来满足现代微处理器不断增长的散热需求。本研究介绍了一种先进的热解决方案，该解决方案结合了具有卓越物理特性的陀螺仪 TPMS 结构，用于微处理器冷却。使用全尺寸散热器模型进行了详细研究，以了解陀螺散热器 (GHS) 内的内部几何结构、流动和传热特性。根据针翅散热器 (PHS) 在不同孔隙率和流速下的热工水力性能，系统地评估了 GHS 设计的热工水力性能。两种散热器均在非均匀加热条件下进行评估，考虑三种加热方案，每种方案有 11 个随机分布的热点。通过计算温度不均匀性、热阻和泵送功率来评估热水力性能。使用陀螺仪 TPMS 单元的单元尺寸和单元壁厚度建立相关性，以计算其水力直径。分析表明，GHS 设计的热性能增强可归因于其复杂而复杂的流动结构以及显着较大的传热表面积。然而，这些相同的因素也会导致显着的高压降。与 PHS 设计相比，GHS 设计在所有选定的孔隙率和流速下均表现出更好的热性能，尽管泵送功率更高。 GHS 设计显示，随着孔隙率的降低，热性能得到改善。 在非均匀加热条件下的研究表明，GHS 设计中热点的温度显着降低，并且它们之间的温度变化也减少。该研究的结果为了解陀螺仪 TPMS 结构在电子冷却中的应用的优点和缺点提供了宝贵的见解。