To meet the heat dissipation requirements of high-frequency and high-power electronic devices, single crystal diamond microchannels (SCD-MC) with secondary channels and rib combinations are proposed. The fluid flow and heat transfer characteristics in SCD-MC with various secondary channels and rectangular rib combinations are investigated through numerical simulations. The comprehensive performance and energy saving effect of the microchannel were evaluated by analyzing the factor of merit and entropy generation performance. The results show that the SCD-MC with secondary channels and rib combinations enhance fluid disturbance and increase the solid–liquid contact area, significantly improving heat transfer. When Reynolds number () is 586, compared with the straight microchannel, the average temperature at the bottom of the SCD-MC with rectangular secondary channels and rectangular rib (Case 5) is reduced by 4.8 K, the heat transfer coefficient is increased by 209.8 %, and the factor of merit is improved by 89.2 %. The entropy generation augmentation number of the Case 5 microchannel was the minimum of 0.52, which has the highest energy saving effect. The factor of merit of the Case 5 microchannel exhibits a tendency to first increase and then decrease with the increase of the relative width of the secondary channel (Ψ), the relative width of the rib (Φ), and the relative position of the rib (Π). At Re = 586, Ψ = 0.933, Φ = 0.667, and Π = 0.5, the factor of merit of the Case 5 microchannel is 2.08, indicating the highest comprehensive performance. This finding provides new ideas and methods for the design and application of microchannel thermal management.

中文翻译：

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带肋和二次通道的单晶金刚石微通道内流体流动和传热特性的数值分析


为了满足高频大功率电子器件的散热要求，提出了具有二次通道和肋组合的单晶金刚石微通道（SCD-MC）。通过数值模拟研究了具有各种二次通道和矩形肋组合的SCD-MC中的流体流动和传热特性。通过分析优值因子和熵产性能，评价微通道的综合性能和节能效果。结果表明，具有辅助通道和肋组合的 SCD-MC 增强了流体扰动，增加了固液接触面积，显着改善了传热。当雷诺数()为586时，与直微通道相比，具有矩形次通道和矩形肋的SCD-MC(工况5)底部平均温度降低了4.8 K，传热系数提高了209.8 %，品质因数提高89.2%。案例5微通道的熵增系数最小为0.52，节能效果最高。案例5微通道的品质因数随着次级通道相对宽度(Ψ)、肋相对宽度(Φ)和肋相对位置的增加呈现先增大后减小的趋势(Π)。当Re=586、Ψ=0.933、Φ=0.667、Π=0.5时，案例5微通道的品质因数为2.08，综合性能最高。这一发现为微通道热管理的设计和应用提供了新的思路和方法。