A Liquid Metal Enabled Fluid Pumping in 3D Space,Advanced Functional Materials

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A Liquid Metal Enabled Fluid Pumping in 3D Space
Advanced Functional Materials ( IF 18.5 ) Pub Date : 2024-08-02 , DOI: 10.1002/adfm.202410349
Rui Xue ₁ , Ruizhe Yang _{1,

2} , Weiyu Liu ₃ , Wenshang Guo _{1,

2} , Zhihui Qu _{1,

2} , Shuai Wang _{1,

2} , Zhenyou Ge _{1,

2} , Chunlei Song _{1,

2} , Liang Ding ₁ , Ye Tao ₁ , Yukun Ren _{1,

2}

Affiliation

As the main prerequisite for flow in microfluidic chips, micropumps have always been the core component of microfluidic systems. With the continuous development trend of the three dimensions and high integration for microfluidic systems in recent years, combining the characteristics of micro and drivable fluid flowing in 3D space is the current mainstream research goal in the functions of the micropumps. Here, based on the continuous electrowetting effect in a confined space of the Ga-based liquid metal (LM), an LM driving micropump structure is proposed that enables fluid to be pumped up to 200 mm in height, which meets the major demands of microfluidic system working environments. The pumping mechanism is experimentally analyzed and demonstrated, as well as the working performance of the micropump under different output modes (continuous flow and pulsatile flow). The feasibility of this micropump is also verified through a fluid pumping experiment in complex shaped channels and a temperature management experiment in 3D space. This work is envisaged to expand the function and application area of the electric actuators driven by the Ga-based LM and provide new support for micropumps in the 3D microfluidic chip system.

中文翻译：

在 3D 空间中支持液态金属的流体泵送

作为微流控芯片中流动的主要前提，微泵一直是微流控系统的核心部件。近年来，随着微流控系统三维化、高集成度的持续发展趋势，结合微流体和可驱动流体在三维空间中流动的特点是当前微泵功能方面的主流研究目标。在这里，基于镓基液态金属（LM）在有限空间内的连续电润湿效应，提出了一种 LM 驱动微泵结构，使流体能够泵送高达 200 mm 的高度，从而满足微流体系统工作环境的主要需求。实验分析和论证了泵送机构，以及微泵在不同输出模式（连续流和脉动流）下的工作性能。这种微泵的可行性也通过复杂形状通道中的流体泵送实验和 3D 空间中的温度管理实验得到了验证。这项工作旨在扩展基于 Ga的 LM 驱动的电动执行器的功能和应用领域，并为 3D 微流控芯片系统中的微泵提供新的支持。

更新日期：2024-08-02

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