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Processing of fully dense and high conductivity W[sbnd]20Cu composite via copper melt infiltration into a pressed tungsten wire skeleton
International Journal of Refractory Metals & Hard Materials ( IF 4.2 ) Pub Date : 2024-07-18 , DOI: 10.1016/j.ijrmhm.2024.106809
H. Safahi , M. Baniassadi , G. Faraji

The current study proposed melt infiltration into entangled pressed wire as a proper method for rapid and energy-efficient production of tungsten‑copper composites. The process includes wire packing through different strategies, pressing, and infiltration steps. First, a predesigned wire structure through different strategies of simple, spiral, cylindrical, and spherical is packed and pressed to form a permeable tungsten skeleton. Then, by infiltrating molten copper under a dry hydrogen atmosphere into the porous preforms, the W20Cu composite is fabricated and characterized. An almost fully dense sample with excellent hardness of 238.1 HV1 and high conductivity of 58.64% IACS in W20Cu composite was achieved. These values are almost 25% and 50% higher than that from the conventional melt infiltration method, respectively. It was seen that the packing strategy is so effective in achieving the best properties where the processed composite by spherical packing strategy exhibits better density, conductivity, and hardness than the sample produced via the other three packing strategies. However, all the properties of the melt infiltration into entangled pressed wire processed composite via all packing strategies are higher than those processed via conventional methods. These excellent properties could be attributed to the mostly bonded tungsten phase, high purity, pore-free, and suitable distribution of tungstens which are a result of this process characteristics. Besides, lower cycle time and energy consumption are other advantages of the new process compared to conventional melt infiltration via powder metallurgy. This approach presents a promising prospect for future industrial applications.

中文翻译:


通过铜熔体渗入压制钨丝骨架加工全致密高导电性 W[sbnd]20Cu 复合材料



目前的研究提出,将熔体渗透到缠结的压线中作为快速、高效生产钨铜复合材料的合适方法。该过程包括通过不同策略进行线材包装、压制和渗透步骤。首先,通过简单、螺旋、圆柱形、球形等不同策略,将预先设计的丝结构进行封装和压制,形成可渗透的钨骨架。然后,通过在干燥氢气气氛下将熔融铜渗透到多孔预制件中,制造并表征了 W20Cu 复合材料。在 W20Cu 复合材料中获得了几乎完全致密的样品,具有 238.1 HV1 的优异硬度和 58.64% IACS 的高电导率。这些值分别比传统熔体渗透法的值高出近 25% 和 50%。可以看出,填充策略在实现最佳性能方面非常有效,其中通过球形填充策略加工的复合材料比通过其他三种填充策略生产的样品表现出更好的密度、电导率和硬度。然而,通过所有填充策略熔体渗透到缠结压线加工的复合材料中的所有性能都高于通过传统方法加工的性能。这些优异的性能可归因于主要结合的钨相、高纯度、无孔以及钨的适当分布,这是该工艺特性的结果。此外,与传统的粉末冶金熔渗相比,新工艺的其他优点是周期时间短、能耗低。这种方法为未来的工业应用提供了广阔的前景。
更新日期:2024-07-18
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