In this study, a series of W/Cu multilayer composites were prepared by W and Cu foils bonded at temperatures ranging from 700 to 900 °C through field assisted sintering technique. The microstructure, bending property, thermal conductivity and thermal diffusivity of the W/Cu multilayer composites were investigated. The microstructure in the W layer is similar and the grains grow larger in the Cu layer with increasing bonding temperature. And the interfacial defects between the W layer and Cu layer decrease as the bonding temperature increases. Therefore, the interfacial bonding strength increases as the bonding temperature increases. The interfacial debonding disappears in the W/Cu multilayer composites bonded at 900 °C during three-point bending. Meanwhile, the W/Cu multilayer composites bonded at 900 °C show the highest thermal conductivity (234.6 W/(m⋅K). In addition, the thermal conductivity decreases with the increase of test temperature. The thermal expansion coefficient of the W/Cu multilayer composites bonded at 700 °C is highest. And the model showing the thermal expansion of the W/Cu multilayer composites has been proposed.

中文翻译：

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W/Cu多层复合材料的显微组织和热性能


在这项研究中，通过场辅助烧结技术，在700至900°C的温度下粘合W和Cu箔，制备了一系列W/Cu多层复合材料。研究了W/Cu多层复合材料的显微组织、弯曲性能、导热系数和热扩散系数。 W层中的微观结构相似，并且随着键合温度的升高，Cu层中的晶粒长大。随着键合温度的升高，W层和Cu层之间的界面缺陷减少。因此，界面结合强度随着结合温度的升高而增加。在三点弯曲过程中，在 900 °C 下粘合的 W/Cu 多层复合材料中，界面脱粘现象消失。同时，在900 ℃粘合的W/Cu多层复合材料表现出最高的导热系数（234.6 W/(m⋅K)。此外，导热系数随着测试温度的升高而降低。W/Cu多层复合材料的热膨胀系数Cu 多层复合材料在 700 °C 时粘合最高，并提出了显示 W/Cu 多层复合材料热膨胀的模型。