Stretchable electronics have demonstrated excellent potential in wearable healthcare and conformal integration. Achieving the scalable fabrication of stretchable devices with high functional density is the cornerstone to enable the practical applications of stretchable electronics. Here, a comprehensive methodology for realizing large‐scale, 3D, and stretchable circuits (3D‐LSC) is reported. The soft copper‐clad laminate (S‐CCL) based on the “cast and cure” process facilitates patterning the planar interconnects with the scale beyond 1 m. With the ability to form through, buried and blind VIAs in the multilayer stack of S‐CCLs, high functional density can be achieved by further creating vertical interconnects in stacked S‐CCLs. The application of temporary bonding substrate effectively minimizes the misalignments caused by residual strain and thermal strain. 3D‐LSC enables the batch production of stretchable skin patches based on five‐layer stretchable circuits, which can serve as a miniaturized system for physiological signals monitoring with wireless power delivery. The fabrications of conformal antenna and stretchable light‐emitting diode display further illustrate the potential of 3D‐LSC in realizing large‐scale stretchable devices.

中文翻译：

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大规模、3D 和可拉伸电路的可扩展制造


可拉伸电子产品在可穿戴医疗保健和保形集成方面展现出了巨大的潜力。实现具有高功能密度的可拉伸器件的可扩展制造是实现可拉伸电子产品实际应用的基石。在此，报告了一种实现大规模 3D 和可拉伸电路 (3D-LSC) 的综合方法。基于“铸造和固化”工艺的软覆铜层压板 (S-CCL) 有助于对尺寸超过 1 m 的平面互连进行图案化。由于能够在 S-CCL 多层堆叠中形成通孔、埋孔和盲孔，因此可以通过在堆叠 S-CCL 中进一步创建垂直互连来实现高功能密度。临时粘合基板的应用有效地减少了残余应变和热应变引起的不对中。 3D-LSC能够批量生产基于五层可拉伸电路的可拉伸皮肤贴片，它可以作为通过无线供电监测生理信号的小型化系统。共形天线和可拉伸发光二极管显示器的制造进一步说明了3D-LSC在实现大规模可拉伸设备方面的潜力。