Flow boiling with dielectric coolant is not only a highly desirable approach for effective electronic cooling but is also notorious for its poor scalability. Most current flow boiling enhancement strategies are based on silicon substrates with footprint areas less than 1 cm2, which greatly limits their applications to large-size electronics. This study developed a scalable channel configuration to facilitate efficient flow boiling on large copper substrates (∼10 cm2), in which the channel walls are formed by porous pin-fin arrays. This type of hybrid capillary wall makes up for the limitation of conventional machining in creating intricate features, making it scalable and feasible for developing large-size, two-phase cold plates. Moreover, effective two-phase separation and sustainable film evaporation have been realized in the current work. As a result, the proposed structure achieved a 512% increase in heat dissipation when the heating area scales up 480% from the silicon microchannels with micro-pin-fin arrays. Experiments showed a base heat flux of 106.1 W/cm2 was dissipated over a heating area of 9.6 cm2 using the dielectric fluid HFE-7100 at a mass flux of 247 kg/m2 s. It outperformed most existing metallic flow boiling heat sinks using the same coolant at a similarly high coefficient of performance as small-size enhanced silicon microchannels.

中文翻译：

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可扩展的毛细管针翅结构可实现高效的流动沸腾


使用介电冷却剂的流动沸腾不仅是有效电子冷却的非常理想的方法，而且还因其可扩展性差而臭名昭著。目前大多数流动沸腾增强策略都是基于占地面积小于 1 cm2 的硅基板，这极大地限制了它们在大尺寸电子产品中的应用。这项研究开发了一种可扩展的通道配置，以促进大型铜基板（∼10 cm2）上的高效流动沸腾，其中通道壁由多孔针翅阵列形成。这种类型的混合毛细管壁弥补了传统加工在创建复杂特征方面的局限性，使其具有可扩展性并且可用于开发大尺寸两相冷板。此外，目前的工作已经实现了有效的两相分离和可持续的薄膜蒸发。因此，当加热面积比具有微针鳍阵列的硅微通道扩大 480% 时，所提出的结构实现了 512% 的散热增加。实验表明，使用质量通量为 247 kg/m2 s 的介电液 HFE-7100，在 9.6 cm2 的加热面积上消散 106.1 W/cm2 的基础热通量。它使用相同的冷却剂，性能优于大多数现有的金属流动沸腾散热器，具有与小尺寸增强型硅微通道类似的高性能系数。