Flow boiling with dielectric coolant is not only a highly desirable approach for effective electronic cooling but is also notorious for its poor scalability. Most current flow boiling enhancement strategies are based on silicon substrates with footprint areas less than 1 cm2, which greatly limits their applications to large-size electronics. This study developed a scalable channel configuration to facilitate efficient flow boiling on large copper substrates (∼10 cm2), in which the channel walls are formed by porous pin-fin arrays. This type of hybrid capillary wall makes up for the limitation of conventional machining in creating intricate features, making it scalable and feasible for developing large-size, two-phase cold plates. Moreover, effective two-phase separation and sustainable film evaporation have been realized in the current work. As a result, the proposed structure achieved a 512% increase in heat dissipation when the heating area scales up 480% from the silicon microchannels with micro-pin-fin arrays. Experiments showed a base heat flux of 106.1 W/cm2 was dissipated over a heating area of 9.6 cm2 using the dielectric fluid HFE-7100 at a mass flux of 247 kg/m2 s. It outperformed most existing metallic flow boiling heat sinks using the same coolant at a similarly high coefficient of performance as small-size enhanced silicon microchannels.

中文翻译：

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可扩展的毛细管-针-鳍结构可实现高效的流动沸腾


使用介电冷却剂进行流动沸腾不仅是有效电子冷却的一种非常理想的方法，而且还因其可扩展性差而臭名昭著。大多数电流沸腾增强策略都基于占地面积小于 1 cm2 的硅衬底，这极大地限制了它们在大尺寸电子产品上的应用。本研究开发了一种可扩展的通道配置，以促进在大型铜基板 （∼10 cm2） 上进行高效流动沸腾，其中通道壁由多孔针鳍阵列形成。这种类型的混合毛细管壁弥补了传统加工在创建复杂特征方面的局限性，使其在开发大型两相冷板方面具有可扩展性和可行性。此外，在目前的工作中已经实现了有效的两相分离和可持续的薄膜蒸发。结果，当加热面积从具有微型针鳍阵列的硅微通道放大 480% 时，所提出的结构实现了 512% 的散热增加。实验表明，使用介电流体 HFE-7100 以 247 kg/m2 s 的质量通量在 9.6 cm2 的加热区域上消散了 106.1 W/cm2 的基本热通量。它的性能优于大多数使用相同冷却剂的现有金属流动沸腾散热器，其性能系数与小尺寸增强型硅微通道相似。