With the rapid development of semiconductor manufacturing technology and the booming demand in the electronics market, researchers, guided by Moore’s Law, are working toward the miniaturization and integration of devices: loading more circuits onto smaller semiconductor die and expecting smaller units to achieve superior performance. Therefore, the complexity of the transmission line routing between components or between units is rising, with iterative advanced packaging technology improving the interconnection density in integrated circuits (ICs). As a result, multiple signals in a microwave circuits inevitably intersect at one point, and the crossover comes into being.

中文翻译：

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非多层​​平面分频器的回顾：用于在平面配置中传输和隔离多个信号的设备


随着半导体制造技术的快速发展和电子市场需求的旺盛，研究人员在摩尔定律的指导下，正致力于器件的小型化和集成化：将更多的电路装载到更小的半导体芯片上，期望更小的单元能够实现更优异的性能。因此，随着迭代先进封装技术提高集成电路（IC）中的互连密度，组件之间或单元之间的传输线布线的复杂性正在上升。因此，微波电路中的多个信号不可避免地会在一点相交，交叉现象就产生了。