Reliable long-term function is crucial for flexible and soft bioelectronics. Mechanical defects and permeation of water molecules across the various device layers are the prime drivers of failure, and particularly in applications requiring continuous contact with biofluids (i.e. for implantable applications). To address demanding needs of miniaturization, mechanical compliance and water impermeability, ultra-thin high-barrier encapsulations are a promising way to improve device reliability. In this work, the encapsulation properties of vapour phase infiltration (VPI) of inorganic Al₂O₃ layers deposited by atomic layer deposition (ALD), as bilayers with TiO₂, onto polyimide and parylene C organic substrates are investigated. The layers are grown in a single reactor and the infiltration is performed in a single process, with a resulting nanometric infiltration depth. Mechanical integrity and hermeticity are characterized through tensile fragmentation tests and accelerated aging tests. Flexible Magnesium sensors monitor water vapor permeability in situ. A remarkable improvement in the crack onset strain (∽2.56 times), interfacial shear strength (∽2.1 times), water vapour transmission rate (∽5.2 times) and lifetime performance (∽7.1 times) is achieved, compared to the non-infiltrated ALD coatings. Pluri-infiltrated multilayers are proposed as alternatives to conventional coatings. This work is envisioned to accelerate research progress on hermetic packaging of flexible bioelectronics.

中文翻译：

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通过在保形聚合物中气相渗透金属氧化物制备气相混合多层、亚 5μm 厚的封装，用于柔性生物电子学


可靠的长期功能对于柔性生物电子学至关重要。机械缺陷和水分子在各个器件层中的渗透是故障的主要原因，特别是在需要与生物流体持续接触的应用中（即植入式应用）。为了满足小型化、机械顺应性和防水性的苛刻需求，超薄高阻隔封装是提高器件可靠性的一种有前途的方法。在这项工作中，通过原子层沉积 (ALD) 沉积的无机 Al ₂ O ₃ 层的气相渗透 (VPI) 封装特性，作为具有 TiO ₂