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Enhanced thermal stability of joints formed by Ag-Cu supersaturated solid-solution nanoparticles paste by in-situ Cu nanoprecipitates
Journal of Materials Science & Technology ( IF 11.2 ) Pub Date : 2024-06-27 , DOI: 10.1016/j.jmst.2024.05.070
Wanchun Yang , Xiaoting Wang , Haosong Li , Shaowei Hu , Wei Zheng , Wenbo Zhu , Mingyu Li

Sintered metals serving as thermal interface materials (TIMs) with superior thermal conductivities show the most promise in meeting the heat dissipation requirements of next-generation wide bandgap applications. Nevertheless, their thermal stabilities during high-temperature service provide significant challenges. Herein, a facile approach was developed for one-step synthesis of single-phase Ag-Cu supersaturated solid-solution nanoparticle (Ag-Cu SS-NP) pastes with adjustable Cu contents (up to 37.7 at.%), and they exhibited ultrahigh resistance to oxidation and excellent sinterability. A paste composed of Ag-Cu SS-NPs was sintered in air at 250 °C for 20 min, and this resulted in a dense supersaturated structure with an impressive thermal conductivity of 157.8 W/(m·K) and a room-temperature shear strength of 133.4 MPa. Microstructural analyses demonstrated that Cu had precipitated from the Ag lattice to form Cu nanoprecipitates, which refined the grain sizes and induced high-density dislocations during sintering. For the pinning effect of dislocations and grain boundaries by the Cu nanoprecipitates and coherent twins, the high-temperature (400 °C) shear strength of sintered Ag-Cu SS-NP joints was significantly improved by 67% (58.6 MPa), meanwhile the shear strength after long-term aging at 200 and 300°C for 960 h were increased by 123% (140.3 MPa) and 80% (82.4 MPa) compared to those of sintered Ag NP joints, respectively. The remarkable thermal stability is far superior to traditional TIMs, so the Ag-Cu SS-NP paste exhibits excellent potential as a TIM for high-temperature power device applications.



中文翻译:


通过原位铜纳米沉淀增强银铜过饱和固溶体纳米颗粒糊形成的接头的热稳定性



烧结金属作为热界面材料(TIM),具有优异的导热性,最有希望满足下一代宽带隙应用的散热要求。然而,它们在高温使用期间的热稳定性提出了重大挑战。在此,开发了一种简便的方法,用于一步合成具有可调 Cu 含量(高达 37.7 at.%)的单相 Ag-Cu 过饱和固溶体纳米颗粒(Ag-Cu SS-NP)浆料,并且它们表现出超高的性能。抗氧化性和优异的烧结性。由 Ag-Cu SS-NPs 组成的糊剂在空气中于 250 °C 下烧结 20 分钟,形成致密的过饱和结构,具有 157.8 W/(m·K) 的令人印象深刻的导热率和室温剪切力强度为133.4兆帕。微观结构分析表明,Cu 从 Ag 晶格中析出,形成 Cu 纳米沉淀物,细化了晶粒尺寸并在烧结过程中引起高密度位错。由于Cu纳米沉淀物和共格孪晶对位错和晶界的钉扎效应,烧结Ag-Cu SS-NP接头的高温(400℃)剪切强度显着提高了67%(58.6 MPa),同时与烧结Ag NP接头相比,在200和300℃长期时效960 h后的剪切强度分别提高了123%(140.3 MPa)和80%(82.4 MPa)。卓越的热稳定性远远优于传统的 TIM,因此 Ag-Cu SS-NP 浆料作为高温功率器件应用的 TIM 展现出巨大的潜力。

更新日期:2024-06-28
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