The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.

中文翻译：

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利用电子学和光子学构建 3D 集成电路


电子和光子集成电路的三维集成可以解决现有计算芯片中的关键输入/输出限制，并为未来数据中心和高性能系统的应用创造更大、更复杂的芯片。