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2D materials can unlock single-crystal-based monolithic 3D integration
Nature Electronics ( IF 33.7 ) Pub Date : 2024-06-27 , DOI: 10.1038/s41928-024-01190-4 Kuangye Lu , Jaewoo Shim , Ki Seok Kim , Sang Won Kim , Jeehwan Kim
Nature Electronics ( IF 33.7 ) Pub Date : 2024-06-27 , DOI: 10.1038/s41928-024-01190-4 Kuangye Lu , Jaewoo Shim , Ki Seok Kim , Sang Won Kim , Jeehwan Kim
Two-dimensional (2D) semiconductors could be used to build advanced 3D chips based on monolithic 3D integration. But challenges related to growing single-crystalline materials at low temperatures — as well as enhancing the performance of 2D transistors — need to be addressed first.
中文翻译:
2D 材料可以解锁基于单晶的整体 3D 集成
二维 (2D) 半导体可用于构建基于单片 3D 集成的先进 3D 芯片。但需要首先解决与低温下生长单晶材料以及增强 2D 晶体管性能相关的挑战。
更新日期:2024-06-27
中文翻译:
2D 材料可以解锁基于单晶的整体 3D 集成
二维 (2D) 半导体可用于构建基于单片 3D 集成的先进 3D 芯片。但需要首先解决与低温下生长单晶材料以及增强 2D 晶体管性能相关的挑战。