当前位置：
X-MOL 学术
›
IEEE Trans. Power Electr.
›
论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Review of Die-Attach Materials for SiC HighTemperature Packaging
IEEE Transactions on Power Electronics ( IF 6.6 ) Pub Date : 2024-06-21 , DOI: 10.1109/tpel.2024.3417529 Fengze Hou 1 , Zhanxing Sun 1 , Meiying Su 1 , Jiajie Fan 2 , Xiangan You 1 , Jun Li 1 , Qidong Wang 1 , Liqiang Cao 1 , Guoqi Zhang 3
中文翻译：
SiC 高温封装芯片粘接材料综述
更新日期：2024-06-21
IEEE Transactions on Power Electronics ( IF 6.6 ) Pub Date : 2024-06-21 , DOI: 10.1109/tpel.2024.3417529 Fengze Hou 1 , Zhanxing Sun 1 , Meiying Su 1 , Jiajie Fan 2 , Xiangan You 1 , Jun Li 1 , Qidong Wang 1 , Liqiang Cao 1 , Guoqi Zhang 3
Affiliation
中文翻译：
SiC 高温封装芯片粘接材料综述
京公网安备 11010802027423号