Advanced transfer printing technologies have enabled the fabrication of high-performance flexible and stretchable devices, revolutionizing many research fields including soft electronics, optoelectronics, bioelectronics and energy devices. Despite previous innovations, challenges remain, such as safety concerns due to toxic chemicals, the expensive equipment, film damage during the transfer process and difficulty in high-temperature processing. Thus a new transfer printing process is needed for the commercialization of high-performance soft electronic devices. Here we propose a damage-free dry transfer printing strategy based on stress control of the deposited thin films. First, stress-controlled metal bilayer films are deposited using direct current magnetron sputtering. Subsequently, mechanical bending is applied to facilitate the release of the metal bilayer by increasing the overall stress. Experimental and simulation studies elucidate the stress evolution mechanisms during the processes. By using this method, we successfully transfer metal thin films and high-temperature-treated oxide thin films onto flexible or stretchable substrates, enabling the fabrication of two-dimensional flexible electronic devices and three-dimensional multifunctional devices.

先进的转移印刷技术使得高性能柔性和可拉伸设备的制造成为可能，彻底改变了包括软电子、光电子、生物电子和能源设备在内的许多研究领域。尽管之前有过创新，但挑战仍然存在，例如有毒化学品引起的安全问题、昂贵的设备、转移过程中的薄膜损坏以及高温处理的困难。因此，高性能软电子器件的商业化需要一种新的转移印刷工艺。在这里，我们提出了一种基于沉积薄膜应力控制的无损伤干转移印刷策略。首先，使用直流磁控溅射沉积应力控制的金属双层薄膜。随后，施加机械弯曲，通过增加总应力来促进金属双层的释放。实验和模拟研究阐明了过程中的应力演化机制。通过使用这种方法，我们成功地将金属薄膜和高温处理的氧化物薄膜转移到柔性或可拉伸基板上，从而能够制造二维柔性电子器件和三维多功能器件。