Flexible bismaleimide resins based on bio-based diamine: Synthesis and properties,Journal of Applied Polymer Science

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Flexible bismaleimide resins based on bio-based diamine: Synthesis and properties
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2024-06-15 , DOI: 10.1002/app.55872
Rongye Guo ₁ , Zheng Huang ₁ , Ruibin Wang ₁ , Lingtian Xu ₁ , Liqiang Wan ₁ , Farong Huang ₁

Affiliation

The low toughness and high softening temperature of bismaleimide (BMI) resin limit its application in the field of electronic packaging. Herein, a series of flexible BMI resins with maleic anhydride terminated were synthesized via the imide reaction between dianhydrides and bio-based 8,8′-(4-hexyl-6-octylcyclohexane-1,3-diyl)bis(octane-1-amine) (HOBOA). The degree of polymerization of these BMI resins was controlled to 1, 3, and 5 by adjusting the molar ratio of dianhydrides to HOBOA. These BMI resins show a low softening temperature below 100°C. These BMI resins were cured by the thermal procedure as follows: 145°C/2 h, 185°C/2 h, 225°C/2 h, and 275°C/2 h. The thermal decomposition temperature of cured resins is above 395°C. The tensile testing results demonstrated that cured resins exhibit a high elongation at break of around 60%. The dielectric constant of the cured resins is between 2.72 and 3.09 at room temperature. The water absorption rate of cured resins is less than 0.7% after being soaked in water for 30 days. After the cured resins were soaked separately in acid and alkali, the tensile strength retention rate reaches more than 90%. Additionally, the lap shear strength of cured resins coated on 7075 aluminum alloy exceeds 7.0 MPa.

中文翻译：

基于生物二胺的柔性双马来酰亚胺树脂：合成与性能

双马来酰亚胺(BMI)树脂的低韧性和高软化温度限制了其在电子封装领域的应用。本文通过二酐与生物基8,8'-(4-己基-6-辛基环己烷-1,3-二基)双(辛烷-1-)之间的酰亚胺反应合成了一系列马来酸酐封端的柔性BMI树脂。胺）（HOBOA）。通过调节二酐与HOBOA的摩尔比，将这些BMI树脂的聚合度控制为1、3和5。这些 BMI 树脂具有低于 100°C 的低软化温度。这些BMI树脂通过如下热程序固化：145℃/2小时、185℃/2小时、225℃/2小时和275℃/2小时。固化树脂的热分解温度在395℃以上。拉伸测试结果表明，固化树脂具有约 60% 的高断裂伸长率。室温下固化树脂的介电常数在2.72至3.09之间。固化树脂在水中浸泡30天后吸水率小于0.7%。固化后的树脂分别经过酸、碱浸泡后，拉伸强度保留率达到90%以上。此外，涂覆在7075铝合金上的固化树脂的搭接剪切强度超过7.0 MPa。

更新日期：2024-06-15

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