The void-free filling of microvia through copper electronic plating in printed circuit board application relies critically on multi-component additives including suppressor, accelerator, and leveler. In this study and for the first time, we have developed a new hypotoxic additive, Polixetonium Chloride (PC), as a single component additive in copper electronic plating. Chronocoulometric measurements and finite element method computations combined with Cu electronic plating indicate that the PC can inhibit copper deposition at the mouth of microvia and improve copper deposition at the bottom of microvia by increasing local current densities. Chronopotentiometric studies and in situ FTIR spectroscopic analysis together with density functional theory calculations illustrate that Cl behaves the anchor of PC to enhance its adsorption, and the adsorption ability of PC in microvia is gradually weakened from top to bottom, which is in favor of the electrodeposition of cupric ions at the bottom of microvia for void-free filling.

中文翻译：

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氯化泊酮氯铵作为一种新型、低毒、单一的铜电子电镀添加剂的研究，用于印刷电路板应用中的微孔无空隙填充


在印刷电路板应用中，通过铜电子电镀实现微孔的无空隙填充主要依赖于多组分添加剂，包括抑制剂、促进剂和整平剂。在这项研究中，我们首次开发了一种新型低毒添加剂——氯化波利酮 (PC)，作为铜电子电镀中的单组分添加剂。计时库仑测量和有限元法计算与铜电子电镀相结合表明，PC可以通过增加局部电流密度来抑制微孔口处的铜沉积，并改善微孔底部的铜沉积。计时电位研究、原位FTIR光谱分析以及密度泛函理论计算表明，Cl作为PC的锚定物，增强其吸附，微孔中PC的吸附能力从上到下逐渐减弱，有利于电沉积微孔底部的铜离子，用于无空隙填充。