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Side Connection for High-Efficiency Organic Photovoltaic Modules for Indoor Applications: Shunt Reduction and Performance Improvement
Solar RRL ( IF 6.0 ) Pub Date : 2024-05-23 , DOI: 10.1002/solr.202400303
Ershuai Jiang 1, 2 , Clemens Baretzky 2, 3 , David Müller 2, 3 , Oliver Fischer 2, 4 , Birger Zimmermann 2 , Uli Würfel 1, 2, 3
Affiliation  

Indoor photovoltaics has attracted increasing attention because of its potential to power devices of the Internet of Things. The power conversion efficiency (PCE) of organic photovoltaic (OPV) cells has reached values beyond 30% under indoor light, but for OPV modules it is still significantly lower. One reason is the full width interconnection of subcells in such modules. Here, a new side connection method is presented which significantly reduces shunts and thus improves performance of OPV modules for indoor applications where a large parallel resistance is crucial. To prove its advantage, OPV modules are fabricated on both indium tin oxide (ITO) and ITO-free substrates. Under 500 lux cool white light emitting diode light, the highest PCE of ITO-free side connection modules (SCMs) is 15.1%, while for conventional full width connection modules (FWCMs) it is 14.4%. For ITO-based modules under 1000 lux, it is 2.3% for FWCMs compared to 12.1% for SCMs. Thermography images show that the improvement stems indeed from the reduction of shunts. Finally, results from experiments as well as from numerical simulations illustrate clearly that efficiency losses stemming from the increased series resistance for the side connection are rather small and that they are overcompensated by the increased shunt resistance.

中文翻译:


室内应用高效有机光伏模块的侧连接:减少并联和提高性能



室内光伏发电因其为物联网设备供电的潜力而受到越来越多的关注。有机光伏(OPV)电池在室内光照下的功率转换效率(PCE)已达到30%以上,但对于OPV组件而言,其仍然明显较低。原因之一是此类模块中子单元的全宽互连。这里提出了一种新的侧面连接方法,该方法可显着减少分流,从而提高 OPV 模块的性能,适用于室内应用,在室内应用中,大的并联电阻至关重要。为了证明其优势,OPV 模块在氧化铟锡 (ITO) 和无 ITO 基板上制造。在500勒克斯冷白光发光二极管灯光下,无ITO侧连接模块(SCM)的最高PCE为15.1%,而传统全宽连接模块(FWCM)的最高PCE为14.4%。对于 1000 勒克斯以下的基于 ITO 的模块,FWCM 为 2.3%,而 SCM 为 12.1%。热成像图像显示,这种改进确实源于分流的减少。最后,实验和数值模拟的结果清楚地表明,由于侧连接增加的串联电阻而引起的效率损失相当小,并且它们被增加的分流电阻所过度补偿。
更新日期:2024-05-23
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