<br>通过低温聚合物间键合促进 3D 多芯片集成,ACS Applied Electronic Materials

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通过低温聚合物间键合促进 3D 多芯片集成
ACS Applied Electronic Materials ( IF 4.3 ) Pub Date : 2024-05-16 , DOI: 10.1021/acsaelm.4c00577
Jihun Kim ₁ , Nam Ki Hwang ₂ , Seul Ki Hong ₂ , Min Ju Kim _{2,

3,

4} , Jong Kyung Park ₁

Affiliation

人工智能技术不断发展，对高性能半导体器件的需求需要 3D 互连技术的进步。本研究重点关注 Cu-Cu 与聚合物材料的杂化键合，特别是聚 1,3,5-三乙烯基-1,3,5-三甲基环硅氧烷 (pV3D3)，其以低介电常数 (k = 2.2) 着称。利用引发化学气相沉积，沉积 pV3D3 聚合物薄膜，具有无溶剂、室温沉积和无针孔薄膜等优点。该研究调查了多芯片堆叠在低温环境下聚合物对聚合物热压接合（TCB）的可行性。通过 FTIR 和 XPS 等综合分析表明，表面处理（包括固化和 O ₂ 等离子体处理）在创建 Si-O-Si 桥并促进晶圆到晶圆和通过表面功能进行芯片到芯片的接合。表面处理后在 30 °C、4.5 MPa 的压力下进行 TCB，剪切强度达到 18.94 MPa，展示了低温键合在推进 3D 互连技术方面的潜力。通过深入研究分子结构的变化和对键合机制进行建模，这项研究为各种类型的聚合物键合提供了有益的基础。这项研究有助于开发用于微间距1μm或更小的高密度和高性能互连技术的铜/聚合物混合键合。

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Facilitating 3D Multichip Integration through Low-Temperature Polymer-to-Polymer Bonding

The demand for high-performance semiconductor devices in the evolving landscape of AI technologies necessitates advancements in 3D interconnection technologies. This study focuses on Cu–Cu hybrid bonding with polymer materials, specifically poly-1,3,5-trivinyl-1,3,5-trimethyl-cyclosiloxane (pV3D3), known for its low dielectric constant (k = 2.2). Utilizing initiated chemical vapor deposition, polymer thin films of pV3D3 are deposited, offering advantages such as solvent-free, room-temperature deposition and pinhole-free films. The study investigates the feasibility of polymer-to-polymer thermocompression bonding (TCB) in a low-temperature environment for multichip stacks. Through comprehensive analysis, including FTIR and XPS, it is revealed that surface treatments, including curing and O₂ plasma treatment, play a crucial role in creating Si–O–Si bridges and facilitating wafer-to-wafer and die-to-die bonding through surface functionalities. TCB conducted at 30 °C at a pressure of 4.5 MPa after surface treatments yields a shear strength of 18.94 MPa, demonstrating the potential of low-temperature bonding for advancing 3D interconnection technologies. By scrutinizing in depth the molecular structural changes and modeling the bonding mechanism, this study provides a foundation beneficial for various types of polymer-based bondings. This research contributes to the development of Cu/polymer hybrid bonding for high-density and high-performance interconnection technologies with micropitches of 1 μm or less.

更新日期：2024-05-16

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