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Graphene Assembled Films for Radio Frequency and Microwave Technology
Accounts of Materials Research ( IF 14.0 ) Pub Date : 2024-04-12 , DOI: 10.1021/accountsmr.4c00023 Rongguo Song 1, 2 , Ruixue Zhang 1 , Haoran Zu 1, 3 , Daping He 1
Accounts of Materials Research ( IF 14.0 ) Pub Date : 2024-04-12 , DOI: 10.1021/accountsmr.4c00023 Rongguo Song 1, 2 , Ruixue Zhang 1 , Haoran Zu 1, 3 , Daping He 1
Affiliation
With the rapid advancement of information technology, an era of intelligence where seamless interconnectivity prevails is coming. The Internet of Everything (IoE) relies on efficient data transmission, wherein radio frequency (RF) and microwave technologies play a pivotal role. RF and microwave technologies spawn extensive applications in mobile communication, radar systems, remote sensing, and other fields. Traditional conductive materials in RF and microwave electronics include copper, gold, and other metals. However, conventional metal-based electronics are constrained by inherent challenges such as susceptibility to oxidation, high density, restricted heat dissipation capacity, and insustainability, thereby impeding their ability to fulfill the requirements of next-generation RF and microwave electronics. Graphene assembled films emerge as a promising class of carbon materials with excellent electrical and thermal conductivity alongside remarkable mechanical stability, chemical inertness, and low density, which are highly suitable for utilization in RF and microwave electronics applications. RF and microwave electronics based on a graphene assembled film exhibit comparable electrical performance to the metallic materials while offering additional advantages such as lightweight, flexibility, corrosion resistance, enhanced heat dissipation efficiency, and fatigue resistance. These distinguished properties enable electronics to adapt to intelligent environments with high integration levels. Therefore, the application of the graphene assembled film has significantly advanced the progress in RF and microwave technology, facilitating metal-substitution.
中文翻译:
用于射频和微波技术的石墨烯组装薄膜
随着信息技术的迅猛发展,无缝互联的智能时代即将到来。万物互联(IoE)依赖于高效的数据传输,其中射频(RF)和微波技术发挥着关键作用。射频和微波技术在移动通信、雷达系统、遥感等领域有着广泛的应用。射频和微波电子器件中的传统导电材料包括铜、金和其他金属。然而,传统的金属电子产品受到易氧化、高密度、散热能力有限和不可持续性等固有挑战的限制,从而阻碍了它们满足下一代射频和微波电子产品要求的能力。石墨烯组装薄膜是一类有前途的碳材料,具有优异的导电性和导热性,以及卓越的机械稳定性、化学惰性和低密度,非常适合在射频和微波电子应用中使用。基于石墨烯组装薄膜的射频和微波电子器件表现出与金属材料相当的电气性能,同时还具有轻质、柔韧性、耐腐蚀性、增强的散热效率和抗疲劳性等额外优势。这些卓越的特性使电子产品能够适应高集成度的智能环境。因此,石墨烯组装薄膜的应用极大地推动了射频和微波技术的进步,促进了金属替代。
更新日期:2024-04-12
中文翻译:
用于射频和微波技术的石墨烯组装薄膜
随着信息技术的迅猛发展,无缝互联的智能时代即将到来。万物互联(IoE)依赖于高效的数据传输,其中射频(RF)和微波技术发挥着关键作用。射频和微波技术在移动通信、雷达系统、遥感等领域有着广泛的应用。射频和微波电子器件中的传统导电材料包括铜、金和其他金属。然而,传统的金属电子产品受到易氧化、高密度、散热能力有限和不可持续性等固有挑战的限制,从而阻碍了它们满足下一代射频和微波电子产品要求的能力。石墨烯组装薄膜是一类有前途的碳材料,具有优异的导电性和导热性,以及卓越的机械稳定性、化学惰性和低密度,非常适合在射频和微波电子应用中使用。基于石墨烯组装薄膜的射频和微波电子器件表现出与金属材料相当的电气性能,同时还具有轻质、柔韧性、耐腐蚀性、增强的散热效率和抗疲劳性等额外优势。这些卓越的特性使电子产品能够适应高集成度的智能环境。因此,石墨烯组装薄膜的应用极大地推动了射频和微波技术的进步,促进了金属替代。