Traditional chemical mechanical polishing (CMP) normally employs noxious slurries, leading to pollution to the environment. It is a challenge to achieve atomic surfaces of nickel (Ni) alloy using green CMP. To overcome this challenge, a novel green CMP was developed, including composite abrasives of ceria and silica, mandelic acid, hydrogen peroxide and deionized water. Using the developed green CMP, atomic surface with surface roughness Sa of 0.179 nm was achieved, under a scanning area of 50 × 50 μm. Electrochemical tests indicate that the developed slurry has effective corrosion ability on Ni alloy. X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy reveal that the Ni alloy was oxidized by hydrogen peroxide, forming oxides of Ni, chromium (Cr) and molybdenum (Mo). Cr and Mo oxides demonstrated better stability in mandelic acid, while Ni oxides reacted with hydrogen ions and produced Ni and Ni ions. The ions chelated with mandelic acid. Finally, the generated oxides and reaction products were removed by abrasives and a polishing pad under chemical and mechanical balanced functions. The developed green CMP paves a new avenue to obtain atomic surface of a Ni alloy for the possible applications of high-performance components in aerospace industry.

中文翻译：

---

通过控制pH值和氧化还原反应实现镍合金原子表面的新型绿色化学机械抛光


传统的化学机械抛光（CMP）通常使用有毒浆料，导致环境污染。使用绿色 CMP 实现镍 (Ni) 合金的原子表面是一项挑战。为了克服这一挑战，开发了一种新型绿色 CMP，包括二氧化铈和二氧化硅、扁桃酸、过氧化氢和去离子水的复合磨料。使用开发的绿色CMP，在50×50μm的扫描面积下获得了表面粗糙度Sa为0.179nm的原子表面。电化学测试表明，所研制的浆料对镍合金具有有效的腐蚀能力。 X射线光电子能谱和傅里叶变换红外光谱表明，Ni合金被过氧化氢氧化，形成Ni、铬(Cr)和钼(Mo)的氧化物。 Cr和Mo的氧化物在扁桃酸中表现出更好的稳定性，而Ni的氧化物与氢离子反应产生Ni和Ni离子。离子与扁桃酸螯合。最后，在化学和机械平衡作用下，通过磨料和抛光垫去除产生的氧化物和反应产物。所开发的绿色CMP为获得镍合金原子表面铺平了新途径，为航空航天工业中高性能部件的可能应用铺平了道路。