当前位置: X-MOL 学术Robot. Comput.-Integr. Manuf. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Design and implementation of a precision levelling composite stage with active passive vibration isolation
Robotics and Computer-Integrated Manufacturing ( IF 9.1 ) Pub Date : 2024-03-06 , DOI: 10.1016/j.rcim.2024.102744
Lanyu Zhang , Shaoxuan Zhang , Jian Gao , Junhao Yi , Hao Wen , Yun Chen , Xin Chen

The white-light-interference (WLI) three-dimensional topography fine detection has high requirements for the chip-loading stage on levelling and vibration isolation capacity, to ensure that the micro-meter-level structured chip is stably aligned with the WLI scanning head. To meet the high performance detection requirements, this paper designs a novel three-axis levelling and active-passive vibration isolation (LAPV) composite stage, in order to perform precision tilt levelling and wide-frequency-domain vibration isolation. The proposed LAPV stage integrates a modified quasi-zero-stiffness passive vibration isolation unit with an active actuation unit which consists of three voice coil motors (VCMs). It performs active-passive vibration isolation while ensuring a precision levelling. Considering the load bearing and motion vibration of the chip-loading stage, a miniaturized quasi-zero-stiffness mechanism having a specialized leaf spring structure is then designed to limit the vibration isolation operation to the vertical direction and coordinate the levelling motion of the tilt rotation direction, so as to establish a structural decoupling stage. Based on the dynamic and kinematic modelling analysis, a customized PID-Positive Position Feedback (PID-PPF) control scheme is implemented. Afterwards, an experimental verification is conducted. The obtained results show that the stage can achieve a precise levelling motion, reaching a levelling deviation of 33.2 μrad. Moreover, it also can achieve effective active-passive vibration isolation for various vibrations with different frequencies and amplitudes, and the vibration isolation rate can reach 90 %.

中文翻译:


主动被动隔振精密调平复合平台的设计与实现



白光干涉(WLI)三维形貌精细检测对芯片装载阶段的调平和隔振能力要求较高,以保证微米级结构芯片与WLI扫描头稳定对位。为了满足高性能检测要求,本文设计了一种新型三轴调平和主被动隔振(LAPV)复合平台,以实现精密倾斜调平和宽频域隔振。所提出的 LAPV 级集成了改进的准零刚度被动隔振单元和由三个音圈电机 (VCM) 组成的主动驱动单元。它执行主动-被动隔振,同时确保精确调平。考虑切屑装载台的承载和运动振动,设计了具有专门板簧结构的小型化准零刚度机构,将隔振操作限制在垂直方向并协调倾斜旋转的调平运动方向,从而建立结构性脱钩阶段。基于动态和运动学建模分析,实现了定制的 PID 正位置反馈 (PID-PPF) 控制方案。随后进行了实验验证。结果表明,平台能够实现精确的调平运动,调平偏差达到33.2 μrad。而且对不同频率、幅值的各种振动也能实现有效的主被动隔振,隔振率可达90%。
更新日期:2024-03-06
down
wechat
bug