<br>低粘度、低温固化反应性POSS/环氧杂化树脂，具有增强的韧性和综合热性能,RSC Advances

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低粘度、低温固化反应性POSS/环氧杂化树脂，具有增强的韧性和综合热性能
RSC Advances ( IF 3.9 ) Pub Date : 2024-03-01 , DOI: 10.1039/d3ra08390j
Ruiyan Han ₁ , Xiaoyan Ma ₁ , Lifeng Cai ₁ , Zongwu Zhang ₁ , Yiliang Fang ₁ , Jian Wang ₁

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低温固化（ T_固化≤100℃）的环氧树脂的机械性能和耐高温性能往往较差，而大多数环氧树脂的增韧改性方法往往会损害耐热性，这极大地限制了其实际应用。因此，本工作报道了一种低粘度低温固化环氧杂化树脂体系（OPEP），采用E-51作为树脂基体，液体酸酐（MHHPA）作为固化剂，叔胺（DMBA）作为固化促进剂，和反应性八环氧基封端的多面体低聚倍半硅氧烷（OG-POSS）作为增韧改性剂。结果表明，OPEP体系具有优异的加工性能，粘度低，加工窗口期长，满足低温固化的实际要求。 OG-POSS与树脂基体表现出优异的相容性和反应活性，其添加略微降低了固化反应的Eα ，对环氧树脂的固化_有一定的促进作用。此外，OPEP树脂的固化反应速率符合Šesták-Berggren自催化动力学模型。 OPEP树脂的冲击强度、弯曲强度、拉伸强度和断裂伸长率分别达到最大值15.55 kJ m ^-2 、121.65 MPa、90.36 MPa和2.48%，分别提高了55.97%、3.1%、64.68%，与纯树脂相比，分别提高了 26.51% 和 26.51%。值得注意的是，由于OG-POSS的耐热无机硅笼结构，OPEP _0.02树脂的热分解温度( T _d5 )、玻璃化转变温度( T _g )和热变形温度( T _HDT )为313.2° C、123.7℃和102.0℃，与纯树脂相比分别提高了13.0℃、2.3℃和6.8℃，这是一般热固性树脂增韧改性方法难以实现的。该研究利用有机-无机纳米杂化材料（POSS）协调优化树脂的韧性和热稳定性，为制备低温固化的高性能环氧树脂提供指导。

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Low viscosity and low temperature curing reactive POSS/epoxy hybrid resin with enhanced toughness and comprehensive thermal performance

The mechanical and high-temperature resistance properties of epoxy resins cured at low temperatures (T_curing ≤ 100 °C) are often inferior, and the most toughening modification methods for epoxy resins tend to compromise thermal resistance, which significantly limit the practical applications of it. Therefore, this work reported a low viscosity and low-temperature curing epoxy hybrid resin system (OPEP), adopting E-51 as a resin matrix, liquid anhydride (MHHPA) as a curing agent, tertiary amine (DMBA) as a curing accelerator, and reactive octa-epoxy terminated polyhedral oligomeric silsesquioxane (OG-POSS) as a toughening modifier. Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing. The OG-POSS exhibits superior compatibility and reactivity with the resin matrix, and its addition slightly reduces the E_α of the curing reaction and has a certain promotive effect on the curing of epoxy resin. In addition, the curing reaction rate of the OPEP resin complies with the Šesták–Berggren autocatalytic kinetics model. The impact strength, flexural strength, tensile strength, and elongation at break of the OPEP resin reached a maximum of 15.55 kJ m⁻², 121.65 MPa, 90.36 MPa, and 2.48%, representing increases of 55.97%, 3.1%, 64.68%, and 26.51% compared to those of the pure resin, respectively. Notably, due to the heat-resistant inorganic silicon cage structure of OG-POSS, the thermal decomposition temperature (T_d5), glass transition temperature (T_g), and heat distortion temperature (T_HDT) of the OPEP_0.02 resin were 313.2 °C, 123.7 °C, and 102.0 °C, showing increases of 13.0 °C, 2.3 °C, and 6.8 °C compared to the pure resin, respectively, which is difficult to achieve for the general thermosetting resin toughening modification method. This research utilized organic–inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.

更新日期：2024-03-01

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