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Three-Dimensional Topography of High-Aspect Ratio Trenches by Sample-Induced Aberration-Compensable Coherence Scanning Interferometry
ACS Photonics ( IF 6.5 ) Pub Date : 2024-02-20 , DOI: 10.1021/acsphotonics.3c01466 Jianqiu Ma 1 , Qun Yuan 1 , Zhishan Gao 1 , Xiao Huo 1 , Zhiyi Xu 1 , Jiale Zhang 1 , Xiaoxin Fan 1 , Dan Zhu 1 , Zhenyan Guo 1 , Lihua Lei 2 , Yunxia Fu 2 , Hongtao He 3 , Lin Zhao 3
ACS Photonics ( IF 6.5 ) Pub Date : 2024-02-20 , DOI: 10.1021/acsphotonics.3c01466 Jianqiu Ma 1 , Qun Yuan 1 , Zhishan Gao 1 , Xiao Huo 1 , Zhiyi Xu 1 , Jiale Zhang 1 , Xiaoxin Fan 1 , Dan Zhu 1 , Zhenyan Guo 1 , Lihua Lei 2 , Yunxia Fu 2 , Hongtao He 3 , Lin Zhao 3
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Nondestructive three-dimensional topography of high-aspect ratio structures presents significant challenges, particularly in accurately capturing the bottom topography. Here, a sample-induced aberration-compensable near-infrared coherence scanning interferometry is proposed, with the capacity of measuring the bottom of high-aspect ratio structures and reconstructing full three-dimensional topographies. While near-infrared light penetrates the silicon to boost probe throughput, the modulation by high-aspect ratio structures defocuses the probe at the bottom. To comprehend the modulation characteristics and devise solutions, the finite element method and angular spectrum diffraction modeling are combined to analyze the high-aspect ratio sample-induced modulation, and then, a solution is devised to refocus the probe. Consequently, an aberration detection optical path integrated into the coherence scanning interferometry system is constructed. By utilizing the measured aberrations as feedback, an aberration-compensating wavefront corrector is then introduced in the test arm to refocus the probes to the bottom. The proposed method surpasses the restrictions associated with the aspect ratio in three-dimensional topography. Experiments on ∼200 μm-deep and ∼20:1-aspect ratio trenches showcase simultaneous high microscopic lateral resolution and interferometric vertical precision for accurate three-dimensional high-aspect ratio trench metrology.
中文翻译：
通过样本诱导像差补偿相干扫描干涉测量高深宽比沟槽的三维形貌
高纵横比结构的无损三维形貌提出了重大挑战，特别是在准确捕获底部形貌方面。在此，提出了一种样品引起像差补偿的近红外相干扫描干涉测量方法，具有测量高深宽比结构底部和重建全三维形貌的能力。虽然近红外光穿透硅以提高探头吞吐量，但高纵横比结构的调制使底部的探头散焦。为了理解调制特性并设计解决方案，有限元方法和角谱衍射建模相结合来分析高深宽比样品引起的调制，然后设计了一种重新聚焦探头的解决方案。由此，构建了集成到相干扫描干涉测量系统中的像差检测光路。通过利用测量的像差作为反馈，然后在测试臂中引入像差补偿波前校正器，以将探头重新聚焦到底部。所提出的方法超越了三维地形中与纵横比相关的限制。在约 200 微米深和约 20:1 深宽比沟槽上进行的实验展示了同时具有高微观横向分辨率和干涉垂直精度，可实现精确的三维高深宽比沟槽计量。
更新日期：2024-02-20
中文翻译：
通过样本诱导像差补偿相干扫描干涉测量高深宽比沟槽的三维形貌
高纵横比结构的无损三维形貌提出了重大挑战，特别是在准确捕获底部形貌方面。在此，提出了一种样品引起像差补偿的近红外相干扫描干涉测量方法，具有测量高深宽比结构底部和重建全三维形貌的能力。虽然近红外光穿透硅以提高探头吞吐量，但高纵横比结构的调制使底部的探头散焦。为了理解调制特性并设计解决方案，有限元方法和角谱衍射建模相结合来分析高深宽比样品引起的调制，然后设计了一种重新聚焦探头的解决方案。由此，构建了集成到相干扫描干涉测量系统中的像差检测光路。通过利用测量的像差作为反馈，然后在测试臂中引入像差补偿波前校正器，以将探头重新聚焦到底部。所提出的方法超越了三维地形中与纵横比相关的限制。在约 200 微米深和约 20:1 深宽比沟槽上进行的实验展示了同时具有高微观横向分辨率和干涉垂直精度，可实现精确的三维高深宽比沟槽计量。
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