Low-Dielectric-Constant Benzocyclobutene-Based Polysiloxane Resins with Excellent Photoimaging Properties,ACS Applied Polymer Materials

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Low-Dielectric-Constant Benzocyclobutene-Based Polysiloxane Resins with Excellent Photoimaging Properties
ACS Applied Polymer Materials ( IF 4.4 ) Pub Date : 2024-02-15 , DOI: 10.1021/acsapm.3c02813
Xinyu Hu ₁ , Hanlin Du ₁ , Juan Peng ₁ , Huan Hu ₂ , Xian Li ₁ , Yun Tang _{1,

3} , Jiajun Ma ₁ , Xu Ye ₄ , Junxiao Yang ₁

Affiliation

With the rapid rise of the Internet of things, high-frequency mobile communications, artificial intelligence, and other application scenarios, demand has been increasing for integrated circuits with a high performance, a low power, and a small size. However, in wafer-level packaging, the size reduction, wafer flatness, defect control, and controllable patterning requirements are already high. At the same time, the high degree of integration makes internal thermal management and signal transmission of the circuits more complex. Thus, the development of application-side photolithographically patternable low-dielectric (or ultralow-dielectric) materials has become a significant topic of interest in the chip industry. The main challenge involves the introduction of photoactive structures with beneficial dielectric properties. Herein, we propose a low-dielectric UV-curable resin with a large concentration of photoactive double-bonding groups in the structure. This low-dielectric resin is prepared by UV/thermal curing of a linear silicone–benzocyclobutene oligomer (BCB-LPS). Oligomeric BCB-LPS is prepared by a simple and efficient hydrolytic polycondensation reaction and then capped. In this manner, a large proportion of double bonds and BCB groups are introduced into the resin, allowing BCB-LPS to be both UV- and heat-cured. The cured BCB-LPS resin has high thermal stability, a high mechanical strength, a low dielectric constant, and a low dielectric loss as well as controllable lithographic patternability. Thus, this resin represents a generation of low-dielectric, lithographically patternable materials.

中文翻译：

具有优异光成像性能的低介电常数苯并环丁烯基聚硅氧烷树脂

随着物联网、高频移动通信、人工智能等应用场景的快速兴起，对高性能、低功耗、小尺寸集成电路的需求不断增加。然而，在晶圆级封装中，尺寸减小、晶圆平整度、缺陷控制和可控图案化要求已经很高。同时，高集成度使得电路内部热管理和信号传输更加复杂。因此，应用侧光刻可图案化低介电（或超低介电）材料的开发已成为芯片行业感兴趣的重要话题。主要挑战涉及引入具有有益介电性能的光敏结构。在此，我们提出了一种结构中具有高浓度光活性双键基团的低介电紫外固化树脂。这种低介电树脂是通过线性有机硅-苯并环丁烯低聚物 ( BCB-LPS ) 的紫外线/热固化制备的。通过简单高效的水解缩聚反应制备低聚BCB-LPS ，然后封端。通过这种方式，大部分双键和 BCB 基团被引入到树脂中，使得BCB-LPS可以进行 UV 固化和热固化。固化的BCB-LPS树脂具有高热稳定性、高机械强度、低介电常数和低介电损耗以及可控的光刻图案化能力。因此，这种树脂代表了新一代低介电、可光刻图案化的材料。

更新日期：2024-02-15

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