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Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p-Phenylenediamine into Kapton-Type Polyimide
ACS Applied Polymer Materials ( IF 4.4 ) Pub Date : 2024-02-12 , DOI: 10.1021/acsapm.3c03051 Han Dong 1 , Jie Dong 1 , Xiuting Li 1 , Xin Zhao 1 , Qingsong Xu 1 , Jialin Zhang 1 , Qinghua Zhang 1
ACS Applied Polymer Materials ( IF 4.4 ) Pub Date : 2024-02-12 , DOI: 10.1021/acsapm.3c03051 Han Dong 1 , Jie Dong 1 , Xiuting Li 1 , Xin Zhao 1 , Qingsong Xu 1 , Jialin Zhang 1 , Qinghua Zhang 1
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To improve the heat resistance of polyimide (PI) fibers for application in harsh environments and establish a correlation among the chemical structure, fabrication performance, and material properties, a simple and rigid diamine, p-phenylenediamine (p-PDA) was incorporated into the Kapton-type PI synthesized from pyromellitic dianhydride and 4,4-diaminodiphenylmethane (ODA). The comprehensive properties of these co-PI fibers were systematically investigated to assess the impact of p-PDA addition. Two-dimensional wide-angle X-ray diffraction (WAXD) was used to investigate the evolution of the aggregation structure of the co-PI fibers during the processing. The thermogravimetric analyzer (TGA) test shows that the incorporation of p-PDA improves the heat resistance of polyimide fibers, with the 10 wt % weight loss temperature (T10%) ranging from 582 to 605 °C and the maximum decomposition temperature (Tmax) of 611–635 °C for the co-PI fibers with different p-PDA contents. Additionally, the potential degradation mechanism of the PI fibers was examined by utilizing pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS) and other thermal analyses. By introducing p-PDA, the content of O element (ether bond in ODA) in the system decreases, leading to a reduction in oxygen free radicals from ODA during the decomposition process of polyimides. The decrease in active species can cause a decrease in the decomposition rate and improve the heat resistance of the polyimide fibers. The study of the thermal decomposition mechanism of polyimides provides a valuable foundation for the preparation of high-performance polymer fibers with enhanced thermal resistance and excellent overall performance.
中文翻译：
Kapton型聚酰亚胺引入对苯二胺制备耐高温聚酰亚胺纤维
为了提高聚酰亚胺（PI）纤维在恶劣环境下的耐热性，并建立化学结构、制造性能和材料性能之间的相关性，将一种简单且刚性的二胺，对苯二胺（p -PDA）引入到聚酰亚胺纤维中。由均苯四酸二酐和 4,4-二氨基二苯甲烷 (ODA) 合成的 Kapton 型 PI。对这些 co-PI 纤维的综合性能进行了系统研究，以评估添加p -PDA的影响。使用二维广角 X 射线衍射 (WAXD) 研究加工过程中 co-PI 纤维聚集结构的演变。热重分析仪（TGA）测试表明， p -PDA的掺入提高了聚酰亚胺纤维的耐热性，其10 wt%失重温度（T 10%）范围为582~605 ℃，最高分解温度（T对于具有不同p -PDA 含量的 co-PI 纤维，最高温度为 611–635 °C 。此外，还利用热解气相色谱/质谱 (Py-GC/MS) 和其他热分析方法检查了 PI 纤维的潜在降解机制。通过引入p -PDA，体系中O元素（ODA中的醚键）含量降低，导致聚酰亚胺分解过程中ODA中的氧自由基减少。活性物种的减少可以引起分解速率的降低并提高聚酰亚胺纤维的耐热性。聚酰亚胺热分解机理的研究为制备具有增强耐热性和优异综合性能的高性能聚合物纤维提供了宝贵的基础。
更新日期：2024-02-12
中文翻译：
Kapton型聚酰亚胺引入对苯二胺制备耐高温聚酰亚胺纤维
为了提高聚酰亚胺（PI）纤维在恶劣环境下的耐热性，并建立化学结构、制造性能和材料性能之间的相关性，将一种简单且刚性的二胺，对苯二胺（p -PDA）引入到聚酰亚胺纤维中。由均苯四酸二酐和 4,4-二氨基二苯甲烷 (ODA) 合成的 Kapton 型 PI。对这些 co-PI 纤维的综合性能进行了系统研究，以评估添加p -PDA的影响。使用二维广角 X 射线衍射 (WAXD) 研究加工过程中 co-PI 纤维聚集结构的演变。热重分析仪（TGA）测试表明， p -PDA的掺入提高了聚酰亚胺纤维的耐热性，其10 wt%失重温度（T 10%）范围为582~605 ℃，最高分解温度（T对于具有不同p -PDA 含量的 co-PI 纤维，最高温度为 611–635 °C 。此外，还利用热解气相色谱/质谱 (Py-GC/MS) 和其他热分析方法检查了 PI 纤维的潜在降解机制。通过引入p -PDA，体系中O元素（ODA中的醚键）含量降低，导致聚酰亚胺分解过程中ODA中的氧自由基减少。活性物种的减少可以引起分解速率的降低并提高聚酰亚胺纤维的耐热性。聚酰亚胺热分解机理的研究为制备具有增强耐热性和优异综合性能的高性能聚合物纤维提供了宝贵的基础。
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