The development of highly integrated electronic devices has placed higher demands on the thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation properties of electronic packaging materials. In this work, a facile strategy for the fabrication of epoxy composites with AlO platelet-isolated MXene porous microsphere networks was proposed. The composites were prepared by a simple salt-template method under vortex conditions and showed effective electric insulation as well as satisfactory EMI shielding and thermal conductivity properties. Particularly, the EMI shielding performance is enhanced by MXene porous microspheres with multi-interfacial conductive networks. Moreover, AlO platelets (AlOp) with shell-like arrangement enrich the thermal conductivity paths on one hand and synergistically interact with the epoxy matrix to intercept the electron transfer between the MXene porous microspheres on the other hand. As a result, the obtained MXene/AlOp/Epoxy composites exhibit excellent thermal conductivity (2.1 W/mK) and satisfactory EMI shielding performance (22.3 dB at 8.6 GHz), while maintaining high electrical insulation (1.2 × 10 Ωcm). This paper provided a new idea to synergistically improve the electrical insulation, thermal conductivity and EMI shielding properties of epoxy composites.

中文翻译：

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Al2O3 片状隔离 MXene 多孔微球网络具有令人满意的导热性和电磁屏蔽性以及电绝缘性的环氧复合材料


高集成电子器件的发展对电子封装材料的导热性、电磁干扰（EMI）屏蔽和电绝缘性能提出了更高的要求。在这项工作中，提出了一种利用 Al2O3 片状隔离 MXene 多孔微球网络制造环氧复合材料的简便策略。该复合材料通过简单的盐模板法在涡流条件下制备，并表现出有效的电绝缘性以及令人满意的EMI屏蔽和导热性能。特别是，具有多界面导电网络的 MXene 多孔微球增强了 EMI 屏蔽性能。此外，具有壳状排列的Al2O3薄片（AlOp）一方面丰富了导热路径，另一方面与环氧树脂基体协同相互作用以拦截MXene多孔微球之间的电子传递。结果，所获得的 MXene/AlOp/Epoxy 复合材料表现出优异的导热性 (2.1 W/mK) 和令人满意的 EMI 屏蔽性能 (8.6 GHz 时为 22.3 dB)，同时保持高电绝缘性 (1.2 × 10 Ωcm)。该论文为协同提高环氧复合材料的电绝缘性、导热性和EMI屏蔽性能提供了新思路。