Our official English website, www.x-mol.net, welcomes your
feedback! (Note: you will need to create a separate account there.)
A Dual Encapsulation Strategy for High-Temperature Micro PCM Particles with High Cyclic Durability
Small ( IF 13.0 ) Pub Date : 2024-01-02 , DOI: 10.1002/smll.202310252 Kaichen Wang 1 , Keyu Tao 1 , Feng Ye 1 , Tieying Wang 2 , Chao Xu 1
Small ( IF 13.0 ) Pub Date : 2024-01-02 , DOI: 10.1002/smll.202310252 Kaichen Wang 1 , Keyu Tao 1 , Feng Ye 1 , Tieying Wang 2 , Chao Xu 1
Affiliation
|
Addressing critical issues such as high-temperature corrosion, leakage, degradation, and subpar cyclic performance is imperative for phase change materials (PCMs), prompting the development of appropriate encapsulation techniques to surmount these challenges. In this study, a dual encapsulation strategy is proposed for high-temperature micro PCM particles. Al–Si core is microencapsulated via the “solvent evaporation-heating curing” method. Subsequently, TiO2 is employed as the skeleton material for form-stable encapsulation of PCM microcapsules by “cold pressed sintering”. Detailed analysis of the crystalline phase transformation mechanism in the sintering synthesis pathway of TiO2 underscore its potential as a robust structural material with exceptional thermal stability. Furthermore, the incorporation of hexagonal boron nitride (hBN) results in a substantial enhancement of the thermal conductivity of the composites, increasing by 121.1–131.3%. The prepared form-stable phase change microcapsules (FSPCMs) are subjected to 5000 thermal cycles in the air atmosphere. There is no observed PCM leakage or composite ruptures in the FSPCM. Moreover, the oxidized mass gain is merely 3.3%, signifying exceptional oxidation resistance. Thermophysical analysis indicates that FSPCM can retain 91.3% of the enthalpy after 2000 cycles, with over 80% preservation after 5000 cycles, underscoring its remarkable cyclic thermal durability.
中文翻译：
具有高循环耐久性的高温微 PCM 颗粒的双重封装策略
对于相变材料 (PCM) 来说，解决高温腐蚀、泄漏、降解和循环性能不佳等关键问题势在必行，从而促使开发适当的封装技术来克服这些挑战。在这项研究中，提出了一种用于高温微相变材料颗粒的双重封装策略。 Al-Si核通过“溶剂蒸发-加热固化”方法进行微胶囊化。随后，采用TiO 2作为骨架材料，通过“冷压烧结”对PCM微胶囊进行形状稳定的封装。对TiO 2烧结合成途径中结晶相变机制的详细分析强调了其作为具有优异热稳定性的坚固结构材料的潜力。此外，六方氮化硼（hBN）的加入导致复合材料的导热率显着增强，增加了121.1-131.3%。制备的形状稳定的相变微胶囊（FSPCM）在空气气氛中进行5000次热循环。 FSPCM 中没有观察到 PCM 泄漏或复合材料破裂。此外，氧化增重仅为3.3%，具有优异的抗氧化性能。热物理分析表明，FSPCM在2000次循环后可保留91.3%的热函，在5000次循环后可保留80%以上的热函，凸显了其卓越的循环热耐久性。
更新日期：2024-01-02
中文翻译：
具有高循环耐久性的高温微 PCM 颗粒的双重封装策略
对于相变材料 (PCM) 来说，解决高温腐蚀、泄漏、降解和循环性能不佳等关键问题势在必行，从而促使开发适当的封装技术来克服这些挑战。在这项研究中，提出了一种用于高温微相变材料颗粒的双重封装策略。 Al-Si核通过“溶剂蒸发-加热固化”方法进行微胶囊化。随后，采用TiO 2作为骨架材料，通过“冷压烧结”对PCM微胶囊进行形状稳定的封装。对TiO 2烧结合成途径中结晶相变机制的详细分析强调了其作为具有优异热稳定性的坚固结构材料的潜力。此外，六方氮化硼（hBN）的加入导致复合材料的导热率显着增强，增加了121.1-131.3%。制备的形状稳定的相变微胶囊（FSPCM）在空气气氛中进行5000次热循环。 FSPCM 中没有观察到 PCM 泄漏或复合材料破裂。此外，氧化增重仅为3.3%，具有优异的抗氧化性能。热物理分析表明，FSPCM在2000次循环后可保留91.3%的热函，在5000次循环后可保留80%以上的热函，凸显了其卓越的循环热耐久性。
京公网安备 11010802027423号