Formation and Shape Changing of Conductive Helical Ribbons via Deposition of Highly Stressed Films on Mechanically Responsive Substrates,Advanced Functional Materials

当前位置： X-MOL 学术 › Adv. Funct. Mater. › 论文详情

Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)

Formation and Shape Changing of Conductive Helical Ribbons via Deposition of Highly Stressed Films on Mechanically Responsive Substrates
Advanced Functional Materials ( IF 18.5 ) Pub Date : 2023-12-18 , DOI: 10.1002/adfm.202312333
Anjali Chaudhary ₁ , Divya J. Prakash ₂ , RB Jacobson ₁ , Max G. Lagally ₁ , Francesca Cavallo _{2,

3}

Affiliation

This work demonstrates that the electrodeposition of highly stressed films on compliant ribbons is a robust process to obtain helical structures with excellent mechanical stability and potentially high thermal and electrical conductance. Electrodeposition on end-tethered ribbons alters their axial and bending stiffness while imparting mechanical stress to drive the formation of a helix with a microscale diameter and pitch in a controlled and scalable manner. The process generates helices with diameters and pitches between 80 and 200 µm and lengths as large as several millimeters. The approach is amenable to parallel processing a large number of 3D structures on any substrate, including large-area semiconductor wafers. This phenomenon is explained in terms of the change of stress gradients as material is added. Applications of the fabricated helices include antennas, metamaterials, and slow-wave structures in frequency ranges not previously attainable.

中文翻译：

通过在机械响应基底上沉积高应力薄膜来形成导电螺旋带并改变形状

这项工作表明，在顺应带上电沉积高应力薄膜是一种稳健的工艺，可以获得具有优异机械稳定性和潜在高导热性和导电性的螺旋结构。端系带上的电沉积改变了它们的轴向和弯曲刚度，同时施加机械应力，以受控和可扩展的方式驱动具有微米级直径和螺距的螺旋的形成。该过程产生的螺旋直径和螺距在 80 至 200 µm 之间，长度长达数毫米。该方法适用于在任何基板（包括大面积半导体晶圆）上并行处理大量 3D 结构。这种现象可以通过添加材料时应力梯度的变化来解释。所制造的螺旋的应用包括以前无法达到的频率范围内的天线、超材料和慢波结构。

更新日期：2023-12-18

点击分享查看原文

点击收藏

阅读更多本刊新发论文本刊介绍/投稿指南