<br>高性能 MEMS 压力传感器的进步：设计、制造和封装,Microsystems & Nanoengineering

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高性能 MEMS 压力传感器的进步：设计、制造和封装
Microsystems & Nanoengineering ( IF 7.3 ) Pub Date : 2023-12-19 , DOI: 10.1038/s41378-023-00620-1
Xiangguang Han _{1,

2,

3} , Mimi Huang _{1,

2,

3} , Zutang Wu ₄ , Yi Gao _{1,

2,

3} , Yong Xia _{1,

2,

3} , Ping Yang _{1,

2,

3} , Shu Fan _{1,

2,

3} , Xuhao Lu _{1,

2,

3} , Xiaokai Yang _{1,

2,

3} , Lin Liang _{1,

2,

3} , Wenbi Su _{1,

2,

3} , Lu Wang _{1,

2,

3} , Zeyu Cui _{1,

2,

3} , Yihe Zhao _{1,

2,

3} , Zhikang Li _{1,

2,

3} , Libo Zhao _{1,

2,

3} , Zhuangde Jiang _{1,

2,

3}

Affiliation

压力传感器在航空航天、汽车、医疗和消费电子产品中发挥着至关重要的作用。尽管基于微机电系统（MEMS）的压力传感器已经广泛应用了几十年，但最近出现了压力传感器的新趋势，包括更高的灵敏度、更高的精度、更好的多功能性、更小的芯片尺寸和更小的封装尺寸。性能升级的需求导致了传感器材料、设计、制造和封装方法的突破，近几十年来频频出现。本文回顾了MEMS压力传感器的常见新趋势，包括微差压力传感器（MDPS）、谐振压力传感器（RPS）、集成压力传感器、小型化压力芯片和无引线压力传感器。为了实现具有广泛应用潜力的极其灵敏的 MDPS，包括在医疗呼吸机和火灾残压监测仪中，“梁-膜-岛”传感器设计表现出 66 μV/V/kPa 的最佳性能，固有频率为 11.3 kHz。在高精度应用中，对硅和石英 RPS 进行了分析，两种材料在不同的频率温度系数 ( TCF ) 控制方法方面均显示出 ±0.01%FS 的精度。为了提高MEMS传感器集成度，对不同的集成“压力+ x ”传感器设计和制造方法进行了比较。在这个领域，相互耦合效应仍然需要进一步研究。还回顾了微型压力传感器芯片的典型制造方法。迄今为止，芯片厚度尺寸可以控制在<0.1毫米，这对于植入传感器来说是有利的。此外，还分析了无引线压力传感器，该传感器具有极小的封装尺寸和恶劣的环境兼容性。本次审查的结构如下。首先介绍压力传感器的背景。然后根据不同的应用场景对MEMS压力传感器进行了深入介绍。此外，还分析和总结了它们各自的特点和重大进展。最后分析了MEMS压力传感器在不同领域的发展趋势。

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Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based pressure sensors have been widely used for decades, new trends in pressure sensors, including higher sensitivity, higher accuracy, better multifunctionality, smaller chip size, and smaller package size, have recently emerged. The demand for performance upgradation has led to breakthroughs in sensor materials, design, fabrication, and packaging methods, which have emerged frequently in recent decades. This paper reviews common new trends in MEMS pressure sensors, including minute differential pressure sensors (MDPSs), resonant pressure sensors (RPSs), integrated pressure sensors, miniaturized pressure chips, and leadless pressure sensors. To realize an extremely sensitive MDPS with broad application potential, including in medical ventilators and fire residual pressure monitors, the “beam-membrane-island” sensor design exhibits the best performance of 66 μV/V/kPa with a natural frequency of 11.3 kHz. In high-accuracy applications, silicon and quartz RPS are analyzed, and both materials show ±0.01%FS accuracy with respect to varying temperature coefficient of frequency (TCF) control methods. To improve MEMS sensor integration, different integrated “pressure + x” sensor designs and fabrication methods are compared. In this realm, the intercoupling effect still requires further investigation. Typical fabrication methods for microsized pressure sensor chips are also reviewed. To date, the chip thickness size can be controlled to be <0.1 mm, which is advantageous for implant sensors. Furthermore, a leadless pressure sensor was analyzed, offering an extremely small package size and harsh environmental compatibility. This review is structured as follows. The background of pressure sensors is first presented. Then, an in-depth introduction to MEMS pressure sensors based on different application scenarios is provided. Additionally, their respective characteristics and significant advancements are analyzed and summarized. Finally, development trends of MEMS pressure sensors in different fields are analyzed.

更新日期：2023-12-19

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