用于连接 SiC/SiC 部件的低温固化粘合剂：其在宽温度范围内的应用,International Journal of Applied Ceramic Technology

当前位置： X-MOL 学术 › Int. J. Appl. Ceram. Technol. › 论文详情

Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)

用于连接 SiC/SiC 部件的低温固化粘合剂：其在宽温度范围内的应用
International Journal of Applied Ceramic Technology ( IF 1.8 ) Pub Date : 2023-11-30 , DOI: 10.1111/ijac.14614
Naveen Reddy Thuniki ₁ , Krishna Prasad Gangavarapu ₁ , Vikram G. Brijendra ₂ , Kanakaiah Budda ₁ , V. V. Bhanu Prasad ₁

Affiliation

在此，我们报告了酚醛树脂基粘合剂的配方，用于在各种应用温度下连接 SiC 基板。该配方由作为粘结剂的酚醛树脂和作为活性填料的B ₄ C、Al ₂ O ₃、Y ₂ O ₃、Si和SiO ₂粉末的混合物组成。进行 X 射线衍射、热重分析、孔隙率和扫描电子显微镜分析，以了解该粘合剂在暴露于应用温度期间发生的反应。这些结果还用于了解配制的粘合剂在应用过程中涉及的热稳定性和形态变化。研究了用这种酚醛粘合剂制成的 SiC 基板在暴露于 200 至 1500°C 温度后的搭接接头的剪切强度值，以评估其粘合能力。使用这种粘合剂获得的 SiC 接头在固化后表现出 24 MPa 的优异搭接剪切强度值。即使暴露在 200 至 1500°C 的温度下，这些接头也完好无损，剪切强度值超过 5 MPa。结果进一步证实，该粘合剂对于连接 SiC 段具有潜在的可行性，可在氧化环境中的各种温度下应用。

"点击查看英文标题和摘要"

Low-temperature curable adhesive for joining SiC/SiC components: Their application in wide range of temperatures

Herein we report the formulation of phenolic resin–based adhesive to join SiC substrates for a wide range of application temperatures. The formulation consists of phenolic resin as a binder and a mixture of B₄C, Al₂O₃, Y₂O₃, Si, and SiO₂ powders as active filler. The X-ray diffraction, thermogravimetric analysis, porosity, and scanning electron microscopy analysis were carried out to understand the reactions occurring within this adhesive during its exposure to application temperatures. These results were also used to understand thermal stability and morphological changes that are involved in the formulated adhesive during its application. The shear strength values of lap joints of SiC substrates made with this phenolic adhesive after exposure to temperatures between 200 and 1500°C were studied to evaluate its adhesive capacity. Obtained SiC joints with this adhesive have shown an excellent lap shear strength value of 24 MPa after its cure. These joints were also found to be intact with good shear strength values of more than 5 MPa even after exposure to temperatures ranging from 200 to 1500°C. The results further confirm that the adhesive is potentially viable for joining SiC segments for their application at a wide range of temperatures in oxidative environments.

更新日期：2023-11-30

点击分享查看原文

点击收藏

阅读更多本刊新发论文本刊介绍/投稿指南