植入式生物电子学与脑机接口的融合,ACS Applied Electronic Materials

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植入式生物电子学与脑机接口的融合
ACS Applied Electronic Materials ( IF 4.3 ) Pub Date : 2023-11-01 , DOI: 10.1021/acsaelm.3c00879
Minh Anh Huynh ₁ , Thanh-Ha Nguyen ₁ , Tuan-Khoa Nguyen ₁ , Nam-Trung Nguyen ₁

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身体各部位和大脑之间神经元通讯的缺失可能会导致器官衰竭或危及生命的疾病，包括心血管和神经系统疾病。植入式脑机接口（BCI）是一种新兴的跨学科技术，可以弥合沟通差距、恢复器官功能和治疗神经系统疾病。自 1958 年第一台电池供电的起搏器获得成功以来，生物电子技术已经在治疗、诊断和辅助器官植入等广泛的生物医学应用方面取得了巨大的飞跃。材料科学和设备集成的最新发展使得技术范式从刚性转向柔性机械保形植入式 BCI 设备，从而消除设备与组织的不匹配。然而，将基于有机和纳米材料的电子器件植入体内以实现机械和电气稳定性是一个巨大的挑战。用于 BCI 器件的无机和宽带隙材料的最新进展，由于其稳定性、模式和标准化制造工艺，为解决这一瓶颈提供了一条有前途的途径。然而，一些剩余的关键障碍仍然阻碍着软脑机接口设备的应用。本综述总结了这一新兴领域的最新发展和主要挑战，重点关注材料、器件结构、调制、传感、功率和通信等技术和科学方面。还将讨论这项新兴技术当前的挑战和未来前景。

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Convergence of Implantable Bioelectronics and Brain–Computer Interfaces

Missing neuronal communication between parts of the body and the brain can cause organ failures or life-threatening conditions including cardiovascular and neurological diseases. The implantable brain–computer interface (BCI) is an emerging interdisciplinary technology that can bridge the communication gap, restoring organ functions and treating neurological disorders. Since the success of the first battery-powered pacemaker in 1958, bioelectronics technology has made a prodigious leap toward a wide range of biomedical applications such as therapeutics, diagnostics, and assistive organ implants. The latest developments in material sciences and device integrations have enabled a technological paradigm shift from rigid to soft and mechanically conformal implantable BCI devices that could eliminate device–tissue mismatches. However, achieving mechanical and electrical stability with organic- and nanomaterial-based electronics implanted in the body is a big challenge. Recent advances in inorganic and wide bandgap materials for BCI devices provide a promising route to solve this bottleneck due to their stability, modalities, and standardized manufacturing processes. Nevertheless, several remaining key obstacles still hinder the applications of soft BCI devices. This review summarizes the latest developments and key challenges of this emerging field, focusing on technological and scientific aspects such as materials, device structures, modulation, sensing, power, and communication. Current challenges and future perspectives of this emerging technology will also be discussed.

更新日期：2023-11-01

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