Applied Physics A ( IF 2.5 ) Pub Date : 2023-11-01 , DOI: 10.1007/s00339-023-07087-x Longqing He , Zhiwei Luo , Haozhang Liang , Nanshan Ma , Xinyu Liu , Ziyou Zhou , Anxian Lu
In this work, the 30Bi2O3-38B2O3-3SiO2-5Al2O3-(24-x)MnO-xCuO (x = 6, 10, 14, 18, 22 mol%) lead-free bismuth borate glasses were prepared by the melt-quenching method. The effects of CuO substitution for MnO on the structure and properties of the bismuth borate glass were investigated. As the CuO content increases from 6 to 22 mol%, the density of the glass gradually increases while the molar volume shows an opposite trend. The FTIR spectra show that [BiO3], [BiO6], [BO3], and [BO4] are the main structural units in the bismuth borate glass network. The vibrations of both [BiO3] and [BO4] units are enhanced with the increasing CuO content. With the increase of CuO content, the glass transition temperature (Tg) decreases from 438 to 417 ℃ and the softening temperature (Tf) decreases from 470 to 452 ℃. The thermal expansion coefficient (CTE) decreases from 7.875 to 7.702 × 10–6 /℃ in the temperature range of 30–300 ℃, which is between the thermal expansion coefficients of Ag (19 × 10–6 /℃) and silicon substrates (2.5 × 10–6 /℃). In addition, the HF resistance of the bismuth borate glasses gradually improves as the CuO content increases, with a minimum dissolution rate of 14.27 × 10–3 g cm−2 min−1. The NaOH resistance of the bismuth borate glasses initially decreases and then remains stable, with a maximum dissolution rate of 14.66 × 10–3 g cm−2 min−1. The results revealed that the investigated Bi2O3-B2O3-MnO-CuO glass can be used as a suitable alternative to lead-based glass for conductive silver paste.
中文翻译:
导电银浆用低熔点Bi2O3-B2O3-MnO-CuO玻璃的结构与性能
在这项工作中,30Bi 2 O 3 -38B 2 O 3 -3SiO 2 -5Al 2 O 3 -(24-x)MnO-xCuO (x = 6, 10, 14, 18, 22 mol%) 无铅铋采用熔融淬火法制备硼酸盐玻璃。研究了CuO替代MnO对硼酸铋玻璃结构和性能的影响。随着CuO含量从6mol%增加到22mol%,玻璃的密度逐渐增加,而摩尔体积则呈现相反的趋势。FTIR光谱表明[BiO 3 ]、[BiO 6 ]、[BO 3 ]和[BO 4 ]是硼酸铋玻璃网络中的主要结构单元。[BiO 3 ]和[BO 4 ]单元的振动随着CuO含量的增加而增强。随着CuO含量的增加,玻璃化温度( T g )从438℃降低至417℃,软化温度( T f )从470℃降低至452℃。在30~300 ℃温度范围内,热膨胀系数(CTE)从7.875降低到7.702×10 –6 /℃,介于Ag(19×10 –6 / ℃)和硅基板( 2.5×10-6 / ℃)。此外,硼酸铋玻璃的耐高频性能随着CuO含量的增加而逐渐提高,最小溶解速率为14.27×10 –3 g cm -2 min -1。硼酸铋玻璃的耐NaOH性能先下降后保持稳定,最大溶解速率为14.66×10 –3 g cm -2 min -1。结果表明,所研究的Bi 2 O 3 -B 2 O 3 -MnO-CuO玻璃可以用作导电银浆中铅基玻璃的合适替代品。