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Recent advances in structural design of conductive polymer composites for electromagnetic interference shielding
Polymer Composites ( IF 4.8 ) Pub Date : 2023-09-22 , DOI: 10.1002/pc.27773 Shufang Zheng 1 , Yuyin Wang 1 , Yifan Zhu 1 , Chenxiao Zheng 1
Polymer Composites ( IF 4.8 ) Pub Date : 2023-09-22 , DOI: 10.1002/pc.27773 Shufang Zheng 1 , Yuyin Wang 1 , Yifan Zhu 1 , Chenxiao Zheng 1
Affiliation
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The proliferation of electronic devices and wireless communication in our daily lives has led to a significant increase in electromagnetic pollution. This issue poses a serious threat to the proper functioning of electronic equipment as well as human health. Therefore, the investigation of materials with superior electromagnetic interference (EMI) shielding capabilities has garnered growing interest. In this paper, the mechanisms of EMI shielding were first introduced briefly. It was noted that the development of advanced EMI shielding materials involved adhering to principles such as minimizing reflection loss, enhancing absorption loss, and incorporating multiple internal reflections. The construction and shielding properties of traditional EMI shielding materials were introduced. Unlike metal materials with high densities and reflection loss, lightweight conductive polymer composites (CPCs) have been the most promising EMI shielding materials. Meanwhile, carbon-based nanofillers such as carbon nanotubes and graphene nanosheets, along with two-dimensional transition metal carbonitrides MXenes Ti3C2Tx, have emerged as the most promising and versatile conductive nanofillers for CPCs. The EMI shielding performance and loss mechanism of CPCs with homogeneous structure, segregated structure, laminated structure, and porous structure were introduced in detail. It was noted that the EMI shielding performance could be significantly improved by incorporating multiple structures into the same CPCs, such as a rational combination of segregated and porous structures. Finally, the challenges and development trends of CPCs for EMI shielding applications were discussed.
中文翻译：
电磁干扰屏蔽用导电聚合物复合材料结构设计的最新进展
我们日常生活中电子设备和无线通信的普及导致电磁污染显着增加。这个问题对电子设备的正常运行以及人类健康构成严重威胁。因此，对具有优异电磁干扰（EMI）屏蔽能力的材料的研究引起了越来越多的兴趣。本文首先简要介绍了EMI屏蔽的机理。值得注意的是，先进 EMI 屏蔽材料的开发涉及遵循诸如最小化反射损耗、增强吸收损耗以及合并多重内反射等原则。介绍了传统EMI屏蔽材料的结构和屏蔽性能。与高密度和高反射损耗的金属材料不同，轻质导电聚合物复合材料（CPC）一直是最有前途的EMI屏蔽材料。与此同时，碳纳米管和石墨烯纳米片等碳基纳米填料以及二维过渡金属碳氮化物MXenes Ti 3 C 2 T x已成为最有前途和用途广泛的CPC导电纳米填料。详细介绍了均质结构、偏析结构、叠层结构、多孔结构CPC的EMI屏蔽性能和损耗机理。人们指出，通过将多种结构合并到同一CPC中，例如隔离结构和多孔结构的合理组合，可以显着提高EMI屏蔽性能。最后，讨论了CPC在EMI屏蔽应用中面临的挑战和发展趋势。
更新日期：2023-09-22
中文翻译：
电磁干扰屏蔽用导电聚合物复合材料结构设计的最新进展
我们日常生活中电子设备和无线通信的普及导致电磁污染显着增加。这个问题对电子设备的正常运行以及人类健康构成严重威胁。因此，对具有优异电磁干扰（EMI）屏蔽能力的材料的研究引起了越来越多的兴趣。本文首先简要介绍了EMI屏蔽的机理。值得注意的是，先进 EMI 屏蔽材料的开发涉及遵循诸如最小化反射损耗、增强吸收损耗以及合并多重内反射等原则。介绍了传统EMI屏蔽材料的结构和屏蔽性能。与高密度和高反射损耗的金属材料不同，轻质导电聚合物复合材料（CPC）一直是最有前途的EMI屏蔽材料。与此同时，碳纳米管和石墨烯纳米片等碳基纳米填料以及二维过渡金属碳氮化物MXenes Ti 3 C 2 T x已成为最有前途和用途广泛的CPC导电纳米填料。详细介绍了均质结构、偏析结构、叠层结构、多孔结构CPC的EMI屏蔽性能和损耗机理。人们指出，通过将多种结构合并到同一CPC中，例如隔离结构和多孔结构的合理组合，可以显着提高EMI屏蔽性能。最后，讨论了CPC在EMI屏蔽应用中面临的挑战和发展趋势。
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