铜箔与聚四氟乙烯直接粘合，不增加高频印刷线路板表面粗糙度,RSC Advances

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铜箔与聚四氟乙烯直接粘合，不增加高频印刷线路板表面粗糙度
RSC Advances ( IF 3.9 ) Pub Date : 2023-08-30 , DOI: 10.1039/d3ra03839d
Misa Nishino ₁ , Takumi Kodama ₁ , Kazuya Yamamura ₁ , Yuji Ohkubo ₁

Affiliation

聚四氟乙烯（PTFE）因其优异的高频性能而成为高频印刷线路板（PWB）的合适介电基板。然而，据我们所知，尚无研究调查 PTFE 与表面粗糙度较低的铜箔之间的强粘合力。因此，在本研究中，对表面包含弱边界层（WBL）的纯PTFE和不含WBL的玻璃布PTFE（GC-PTFE）进行热辅助等离子体（HAP）处理。治疗。此后，我们研究了所制备的 PTFE 对低表面粗糙度铜箔的表面化学键合状态、表面形貌和粘合性能。据观察，经 HAP 处理的 PTFE 上产生了含氧官能团，并且通过HAP 处理消除了原始纯 PTFE 中的 WBL 。此外，与原始 PTFE 相比，HAP 处理过的 PTFE 的表面粗糙度没有增加。在大气条件下进行热压缩后，HAP处理的纯PTFE和GC-PTFE的粘合强度均为~0.9 N mm ^-1。另外，Cu/纯PTFE和Cu/GC-PTFE在减压下热压缩后粘合强度增加，获得1N mm ^{-1的粘合强度。}尽管铜箔没有被粗糙化，但Cu/PTFE实现了很强的粘合强度。所开发的方法是有利的，因为保持低界面粗糙度对于应用 PTFE 制造高频 PWB 至关重要。

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Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards

Polytetrafluoroethylene (PTFE) serves as a suitable dielectric substrate for high-frequency printed wiring boards (PWBs) owing to its excellent properties at high frequency. However, to the best of our knowledge, no study has investigated the strong adhesion between PTFE and Cu foil with low surface roughness. Therefore, in this study, pure-PTFE comprising a weak boundary layer (WBL) on the surface and glass-cloth-containing PTFE (GC-PTFE), which did not contain a WBL, were subjected to heat-assisted plasma (HAP) treatment. Thereafter, we investigated the surface chemical bonding state, surface morphology, and adhesion properties of the as-prepared PTFE toward Cu foil with low surface roughness. As observed, oxygen-containing functional groups were generated on the HAP-treated PTFE, and the WBL in the as-received pure-PTFE was eliminated via HAP treatment. Moreover, the surface roughness of the HAP-treated PTFE did not increase compared to that of as-received PTFE. After performing thermal compression under atmospheric conditions, the adhesion strength of both HAP-treated pure-PTFE and GC-PTFE was ∼0.9 N mm⁻¹. In addition, the adhesion strength of Cu/pure-PTFE and Cu/GC-PTFE increased after thermal compression under a reduced pressure, and the adhesion strength of 1 N mm⁻¹ was obtained. Although the Cu foil was not roughened, Cu/PTFE realized strong adhesive strength. The developed method is advantageous because maintaining a low interface roughness is crucial for applying PTFE to manufacture high-frequency PWBs.

更新日期：2023-08-30

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