This study focuses on the preparation of thin dicing blades with commendable mechanical properties, in response to the prevailing trend towards reducing dicing spaces between chips. To enhance the performance of electrodeposited Ni-diamond coating and create Ni-based diamond dicing blades, an organic additive called 4-(2-hydroxypropoxy)but-2-yn-1-ol (BMP) was introduced into a nickel sulfamate solution consisting of 5 μm diamond particles. By optimizing the concentration of BMP, it was observed that the co-deposited diamond particle increased while simultaneously reducing roughness and nickel grain size. The composite coating exhibited a preferred crystal orientation on the (111) plane. The attainment of optimal hardness and wear resistance was achieved with an optimum BMP content of 0.15 g/L. Electrochemical and material calculation analyses unveiled the effective adsorption of BMP on the nickel surface, leading to increased cathodic polarization and a consequent reduction in the electrodeposition rate of nickel ions. During the processing of silicon wafers using a 25 μm thick diamond dicing blade, the measured dicing slot and maximum chipping width were determined as 29.6 μm and 6.2 μm, respectively. The results presented in this study considerably expand the avenues for preparing high-performance diamond dicing blades.

本研究的重点是制备具有值得称赞的机械性能的薄切割刀片，以响应减少芯片之间切割空间的普遍趋势。为了提高电沉积镍金刚石涂层的性能并制造镍基金刚石切割刀片，将一种称为 4-(2-羟基丙氧基)but-2-yn-1-ol (BMP) 的有机添加剂引入氨基磺酸镍溶液中，该溶液由以下物质组成： 5μm金刚石颗粒。通过优化 BMP 的浓度，观察到共沉积的金刚石颗粒增加，同时降低了粗糙度和镍晶粒尺寸。复合涂层在(111)面上表现出优选的晶体取向。通过 0.15 g/L 的最佳 BMP 含量实现了最佳硬度和耐磨性。电化学和材料计算分析揭示了 BMP 在镍表面的有效吸附，导致阴极极化增加，从而降低了镍离子的电沉积速率。在使用25μm厚的金刚石划片刀片加工硅片时，测得的划片槽和最大碎裂宽度分别为29.6μm和6.2μm。本研究中提出的结果大大扩展了制备高性能金刚石切割刀片的途径。测量的切割槽和最大碎裂宽度分别确定为29.6μm和6.2μm。本研究中提出的结果大大扩展了制备高性能金刚石切割刀片的途径。测量的切割槽和最大碎裂宽度分别确定为29.6μm和6.2μm。本研究中提出的结果大大扩展了制备高性能金刚石切割刀片的途径。