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Two-Dimensional Semiconductors: From Device Processing to Circuit Integration
Advanced Functional Materials ( IF 18.5 ) Pub Date : 2023-08-17 , DOI: 10.1002/adfm.202304778 Chuming Sheng 1 , Xiangqi Dong 1 , Yuxuan Zhu 1 , Xinyu Wang 1 , Xinyu Chen 1 , Yin Xia 1 , Zihan Xu 2 , Peng Zhou 1 , Jing Wan 3 , Wenzhong Bao 1
Advanced Functional Materials ( IF 18.5 ) Pub Date : 2023-08-17 , DOI: 10.1002/adfm.202304778 Chuming Sheng 1 , Xiangqi Dong 1 , Yuxuan Zhu 1 , Xinyu Wang 1 , Xinyu Chen 1 , Yin Xia 1 , Zihan Xu 2 , Peng Zhou 1 , Jing Wan 3 , Wenzhong Bao 1
Affiliation
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The atomically thin nature and exceptional electrical properties of 2D materials (2DMs) have garnered significant interest in circuit applications. Researchers have developed circuits based on wafer-level 2DM fabrication and monolithic integration in the laboratory. Numerous studies have been conducted on discrete device processes; however, circuit manufacturing is a multifaceted and methodical engineering process that demands seamless integration of multiple procedures. Notably, the optimization of crucial processes holds paramount significance in achieving expected results. This review presents the existing research on process integration of 2DM devices and circuit applications. The selection of suitable 2DMs for circuit applications is outlined, considering their excellent theoretical properties and feasible high-quality growth processes. Drawing on highly mature semiconductor manufacturing process, while incorporating customized key processes, 2DM devices have the potential to strongly compete with, and even outperform, the conventional devices. Finally, the recent circuit applications of 2DMs are also discussed in detail. 2DM integrated circuits (2DM ICs) are now being practically applied in advanced manufacturing, transitioning from laboratory development to fabrication plant deployment. The implementation of underlying 2DM IC fabrication provides effective and unique solutions for More Moore, More than Moore, and Beyond CMOS technology routes.
中文翻译：
二维半导体：从器件加工到电路集成
二维材料 (2DM) 的原子薄特性和卓越的电性能引起了电路应用的极大兴趣。研究人员在实验室中开发了基于晶圆级 2DM 制造和单片集成的电路。对分立器件工艺进行了大量研究；然而，电路制造是一个多方面、有条理的工程过程，需要多个程序的无缝集成。值得注意的是，关键流程的优化对于实现预期结果至关重要。本综述介绍了 2DM 器件工艺集成和电路应用的现有研究。考虑到其优异的理论特性和可行的高质量生长工艺，概述了适合电路应用的 2DM 的选择。2DM器件借鉴高度成熟的半导体制造工艺，同时融入定制关键工艺，具有与传统器件强有力竞争甚至超越的潜力。最后，还详细讨论了 2DM 的最新电路应用。2DM 集成电路（2DM IC）现已在先进制造中得到实际应用，从实验室开发过渡到制造工厂部署。底层2DM IC制造的实施为更多摩尔、超过摩尔和超越CMOS技术路线提供了有效且独特的解决方案。
更新日期：2023-08-17
中文翻译：
二维半导体：从器件加工到电路集成
二维材料 (2DM) 的原子薄特性和卓越的电性能引起了电路应用的极大兴趣。研究人员在实验室中开发了基于晶圆级 2DM 制造和单片集成的电路。对分立器件工艺进行了大量研究；然而，电路制造是一个多方面、有条理的工程过程，需要多个程序的无缝集成。值得注意的是，关键流程的优化对于实现预期结果至关重要。本综述介绍了 2DM 器件工艺集成和电路应用的现有研究。考虑到其优异的理论特性和可行的高质量生长工艺，概述了适合电路应用的 2DM 的选择。2DM器件借鉴高度成熟的半导体制造工艺，同时融入定制关键工艺，具有与传统器件强有力竞争甚至超越的潜力。最后，还详细讨论了 2DM 的最新电路应用。2DM 集成电路（2DM IC）现已在先进制造中得到实际应用，从实验室开发过渡到制造工厂部署。底层2DM IC制造的实施为更多摩尔、超过摩尔和超越CMOS技术路线提供了有效且独特的解决方案。
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